Semiconductor Module Surface Recess for Resin Sheet Bonding Reliability
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Solution Overview
Problem
Thermally conductive insulating resin sheets used in semiconductor modules can be compromised by minute scratches or dents, leading to reduced connection strength, heat dissipation performance, and insulation reliability due to their hardness and lack of deformability.
Innovation Solution
A semiconductor module design featuring a heat dissipation member, a semiconductor device, and a thermally conductive insulating resin sheet, where a concave portion on the semiconductor device's surface directs the resin and air flow away from potential deformation areas, ensuring uniform distribution and improved bonding and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermally conductive insulating resin sheet is used to connect the semiconductor device and heat dissipation member, then insulation performance and heat dissipation are improved, but connection strength is degraded due to scratches or dents on the semiconductor device surface
Solution Approach 1:
The invention introduces a concave portion at a specific location on the semiconductor device surface, creating local structural variation. This concave portion is positioned outward of the region connected to the thermally conductive insulating resin sheet, so it does not compromise the insulation function while providing a structural feature that prevents resin and air concentration in deformation areas, thereby maintaining connection strength despite surface scratches or dents
Solution Approach 2:
The concave portion acts as an intermediary structural feature between the semiconductor device surface and the thermally conductive insulating resin sheet. It serves as a reservoir or diversion channel that prevents resin and air from concentrating in deformation areas ( scratches or dents), thereby mediating the interaction between the rigid resin sheet and the potentially defective semiconductor device surface, maintaining both insulation performance and connection strength
2Temperature
If a thermally conductive insulating resin sheet is used to connect the semiconductor device and heat dissipation member, then heat dissipation performance is improved, but reliability is reduced due to minute scratches or dents on the semiconductor device surface
Solution Approach 1:
The concave portion creates local structural quality variation on the semiconductor device surface. By positioning this concave feature outward of the resin sheet connection region, the invention maintains the thermal conduction path integrity while creating a local structure that prevents resin and air concentration in deformation areas, thereby preserving heat dissipation performance without compromising overall reliability
Solution Approach 2:
The concave portion serves as an intermediary structure that mediates between the thermally conductive insulating resin sheet and the semiconductor device surface with potential defects. It prevents resin and air from concentrating in scratches or dents, ensuring continuous thermal conduction paths are maintained while eliminating reliability concerns associated with surface deformations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the insulation reliability and bonding strength of the semiconductor module by preventing resin and air concentration in deformation areas, thus improving the overall reliability of the semiconductor module and power conversion devices.
Implementation Method 1
a thermally conductive insulating resin sheet connects the heat dissipation member and the semiconductor device
Data Source
AI summary
A reliable semiconductor module and a reliable power conversion device using the semiconductor module are obtained. A semiconductor module includes a heat dissipation member, a semiconductor device, and a thermally conductive insulating resin sheet. The thermally conductive insulating resin sheet connects the heat dissipation member and the semiconductor device. The semiconductor device includes a semiconductor element and a metal wiring member. The metal wiring member is electrically connected to the semiconductor element. The metal wiring member includes a terminal portion protruding outside the semiconductor device. In a surface portion of the semiconductor device, a concave portion is formed outward of a partial region to which the thermally conductive insulating resin sheet is connected. The concave portion is located in a region closer to the heat dissipation member than the terminal portion.