Semiconductor Power Module Terminal Layout to Mitigate Surge Voltage
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Solution Overview
Problem
Semiconductor power modules face issues with surge voltage generation due to mutual inductance components between power supply terminals, which are not adequately canceled out by the magnetic fields generated at the terminals, leading to increased inductance in the current path.
Innovation Solution
The semiconductor power module design features an insulating substrate with power supply terminals arranged on opposite surfaces, allowing for proximity while maintaining insulation, thereby canceling out magnetic fields and reducing mutual inductance between the terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two power supply terminals are arranged across an interval at one end portion of the resin case, then the module structure is simple and easy to manufacture, but the distance between terminals becomes large, causing increased mutual inductance and surge voltage
Solution Approach 1:
The patent transitions from arranging both power supply terminals at one end portion (planar arrangement) to arranging them at opposite end portions along the length direction of the resin case (linear/dimensional arrangement). This dimensional change in terminal placement reduces the mutual inductance between terminals while maintaining manufacturing simplicity.
Solution Approach 2:
Instead of placing both terminals at the same end (conventional approach), the patent inverts the arrangement by placing the first power supply terminal at one end portion and the second power supply terminal at the opposite end portion, thereby reducing mutual inductance effects.
2Object-affected harmful factors
If power supply terminals are arranged close together, then mutual inductance is reduced, but insulation between terminals becomes difficult to maintain
Solution Approach 1:
The patent introduces a partition wall as an intermediary structure that physically separates the first and second power supply terminals. This partition wall maintains electrical insulation between the terminals while allowing them to be positioned at opposite end portions with reduced mutual inductance, thus serving as a mediator between insulation requirements and inductance reduction goals.
3Reliability
If the distance between power supply terminals is increased, then insulation is easier to maintain, but mutual inductance increases and surge voltage is generated
Solution Approach 1:
The patent optimizes terminal placement by positioning them at opposite end portions along the length direction of the resin case, achieving an optimal balance between insulation distance and mutual inductance reduction, rather than simply increasing or decreasing the distance between terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the inductance component in the current path, mitigating surge voltage issues and enhancing the performance of semiconductor power modules.
Implementation Method 1
A magnetic field generated at one power supply terminal and a magnetic field generated at the other power supply terminal
Implementation Method 2
a mutual inductance component between the terminals is thus likely to increase due to a mutual induction effect
Data Source
AI summary
A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.