Semiconductor Module Thermal Switching Element Under Leadframe

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Solution Overview

Problem

Conventional semiconductor device packaging fails to provide sufficient thermal protection for high-power semiconductor devices due to high thermal resistance and sensitivity to process variations, leading to inefficient heat extraction and performance degradation.

Innovation Solution

Incorporating a switching element, such as a thermoelectric device or diode, under the leadframe to enhance thermal conduction while maintaining electrical isolation, allowing for improved heat removal from semiconductor chips without increasing production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional packaging is used, then manufacturing cost is low and structure is simple, but thermal protection is insufficient and heat extraction efficiency is poor

Engineering Contradiction:

Improvethermal protectionVSAvoidpackaging structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

A thermal switching element is introduced as an intermediary component between the semiconductor die and the heat sink. This switching element remains in a high-thermal-conductivity state during normal operation, providing enhanced thermal protection, and transitions to a low-thermal-conductivity state when overheating occurs, thereby mediating thermal management without requiring complex active cooling systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal switching element changes its thermal conductivity parameter in response to temperature variations. During normal operation, it maintains high thermal conductivity for efficient heat extraction; when temperature exceeds a threshold, it transitions to low thermal conductivity to protect the semiconductor die from thermal damage, thus dynamically adjusting thermal parameters to resolve the contradiction.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If conventional packaging is used, then production cost is low, but heat extraction efficiency is poor and performance degrades

Engineering Contradiction:

Improveheat extraction efficiencyVSAvoidproduction cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The thermal switching element serves as a mediator that enhances heat extraction efficiency during normal operation by providing a low-thermal-resistance path from the semiconductor die to the heat sink, while maintaining compatibility with conventional packaging processes and cost structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal switching element is implemented as a simple, cost-effective component that can be integrated into conventional packaging workflows without requiring expensive equipment or complex manufacturing processes, thereby improving heat extraction efficiency while maintaining cost-effectiveness.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If conventional packaging is used, then structure is simple, but thermal resistance is high and reliability is poor

Engineering Contradiction:

Improvethermal management reliabilityVSAvoidpackaging structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The thermal switching element acts as a mediator that reduces thermal resistance between the semiconductor die and heat sink during normal operation, improving thermal management reliability. Its ability to transition to a high-resistance state when overheating occurs provides automatic thermal protection, enhancing reliability without requiring complex active control systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal switching element operates autonomously based on temperature conditions, transitioning between high and low thermal conductivity states without external control. This self-service mechanism improves thermal management reliability by automatically protecting the semiconductor die from thermal damage while maintaining a relatively simple packaging structure.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively addresses thermal management in semiconductor devices by maximizing thermal efficiency and reducing variations in heat extraction, thereby enhancing the performance and reliability of power semiconductor packages.

Implementation Method 1

A switching element is disposed under the second side of the leadframe... configured to conduct heat away from the first discrete semiconductor device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Incorporating a switching element, such as a thermoelectric device or diode, under the leadframe to enhance thermal conduction

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS8860071B2Electro-thermal cooling devices and methods of fabrication thereof

Publication Date: 2014.10.14 INFINEON TECHNOLOGIES AG

AI summary

In one embodiment, a semiconductor module includes a leadframe having a first side and an opposite second side. A semiconductor chip is disposed over the first side of the leadframe. A switching element is disposed under the second side of the leadframe. In another embodiment, a method of forming a semiconductor module includes providing a semiconductor device having a leadframe. A semiconductor chip is disposed over a first side of the leadframe. A switching element is attached at an opposite second side of the leadframe.