Semiconductor Module PCB Cooling With Integrated TEC Heat Sink

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Solution Overview

Problem

Semiconductor modules face performance deterioration due to excessive heat generated by control chips and memory chips, requiring an effective cooling solution.

Innovation Solution

A semiconductor module design incorporating a printed circuit board (PCB), memory chips, a control chip, a heat sink, a thermoelectric cooler (TEC), thermal interface material (TIM), and a temperature sensor, where the TEC is strategically positioned to directly cool the PCB, thereby indirectly cooling connected semiconductor chips without the need for individual heat sinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat sinks are attached to each semiconductor chip, then heat dissipation is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges multiple individual heat dissipation functions into a single integrated heat sink structure that cools multiple semiconductor chips simultaneously. The heat sink is configured with multiple heat dissipation sections that can be attached as one unified component rather than separate heat sinks for each chip, reducing assembly complexity while maintaining effective heat dissipation across all chips.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat sink is designed as a universal cooling solution that serves multiple semiconductor chips with different heat generation characteristics. The heat dissipation sections are configured to accommodate chips generating different amounts of heat, providing a multi-functional cooling system that replaces the need for chip-specific heat sink designs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If individual heat sinks are used for each chip, then cooling effectiveness is improved, but manufacturing cost and assembly time increase

Engineering Contradiction:

Improvecooling effectivenessVSAvoidassembly efficiency

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Multiple heat dissipation functions are combined into a single integrated heat sink assembly that can be manufactured and installed as one unit. This reduces the number of separate components that need to be manufactured, inventoried, and assembled, thereby improving manufacturing efficiency while maintaining effective cooling for each chip.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The unified heat sink is segmented into multiple heat dissipation sections, each designed to cool specific chips. This segmentation allows for optimized heat dissipation for each chip while maintaining the benefit of a unified attachment structure, balancing cooling effectiveness with manufacturing simplicity.

Inventive Principle:

Principle #1Segmentation

3Temperature

If larger TEC area is used, then cooling capacity is improved, but space occupation on PCB increases

Engineering Contradiction:

Improvecooling capacityVSAvoidPCB space occupation

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The TEC is designed with non-uniform heat dissipation characteristics, concentrating cooling capacity in specific local areas where heat generation is highest. This allows the TEC to provide effective cooling with a smaller overall area on the PCB, as the cooling power is optimized for the specific thermal hotspots rather than being uniformly distributed.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heat dissipation parameters of the TEC are optimized to achieve maximum cooling efficiency in a compact form factor. By adjusting thermal conductivity, contact area, and heat dissipation rate parameters, the TEC provides adequate cooling capacity while occupying minimal PCB space.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables rapid heat dissipation from the semiconductor module, maintaining performance by effectively managing heat without the need for additional heat sinks on each chip, thus preventing performance deterioration.

Implementation Method 1

at least one first thermoelectric cooler (TEC)... The first TEC may be on the upper surface of the first PCB to cool heat from the first PCB

Methodology Applied

Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 2

The first TIM may be between the first TEC and the first PCB, and between the first TEC and the heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The heat sink may be configured to surround the first PCB, the first memory chips and the control chip

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS11791236B2Semiconductor module

Publication Date: 2023.10.17 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.