Semiconductor Module Temperature Sensing for Multiple Switching Devices
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Solution Overview
Problem
Existing semiconductor modules, such as intelligent power modules (IPMs), face challenges in accurately measuring the temperature of switching devices like IGBTs to prevent overheating and extend their lifetime, as current temperature measurement methods are inefficient and require multiple circuits for each device.
Innovation Solution
A semiconductor module design incorporating a driver circuit with integrated temperature sensors, a control circuit, and an output circuit that uses diodes for temperature detection, allowing for efficient temperature measurement of multiple switching devices through a single temperature detection circuit, reducing circuit scale and noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple temperature sensors are used for each switching device, then temperature measurement accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent implements a single temperature detection circuit that can measure temperatures of multiple switching devices (first and second switching devices) by sequentially switching between them. The control circuit controls the switching elements to connect the temperature detection circuit to different switching devices at different times, allowing one circuit to perform multiple measurement functions that would traditionally require separate circuits for each device.
Solution Approach 2:
The patent combines multiple temperature measurement functions into a single integrated temperature detection circuit. By merging the measurement capabilities for multiple switching devices into one shared circuit with switching control, the design reduces the total number of temperature sensors and circuits needed, thereby simplifying device complexity while maintaining measurement accuracy for all switching devices.
2Measurement precision
If multiple temperature sensors are used for each switching device, then temperature measurement accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The patent implements a single temperature detection circuit that can measure temperatures of multiple switching devices (first and second switching devices) by sequentially switching between them. The control circuit controls the switching elements to connect the temperature detection circuit to different switching devices at different times, allowing one circuit to perform multiple measurement functions that would traditionally require separate circuits for each device.
Solution Approach 2:
The patent combines multiple temperature measurement functions into a single integrated temperature detection circuit. By merging the measurement capabilities for multiple switching devices into one shared circuit with switching control, the design reduces the total number of temperature sensors and circuits needed, thereby simplifying device complexity while maintaining measurement accuracy for all switching devices.
3Reliability
If separate temperature detection circuits are used for each switching device, then measurement reliability is improved, but noise interference increases
Solution Approach 1:
The patent introduces switching elements as intermediaries between the temperature detection circuit and multiple switching devices. These switching elements act as mediators that selectively connect the temperature detection circuit to specific switching devices only when needed for measurement. This isolation approach reduces continuous electrical interference and noise coupling between parallel circuits, while the controlled switching ensures reliable temperature measurements are obtained when required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate temperature measurement of multiple switching devices is achieved with reduced circuit complexity, enabling early detection of overheating and extending device lifetime while minimizing manufacturing costs.
Implementation Method 1
uses diodes for temperature detection
Data Source
AI summary
A semiconductor module, including: a first terminal and a second terminal; a driver circuit including a plurality of pairs of switching devices, each pair including a first switching device on a power supply side of the semiconductor module, and a second switching device on a ground side of the semiconductor module; at least one temperature sensor, each configured to detect a temperature of at least one switching device among the plurality of pairs of switching devices; a control circuit configured to control switching of the plurality of pairs of switching devices; and an output circuit configured to output a signal indicative of the temperature via the first and second terminals.


