Semiconductor Module Signal Terminal Arrangement for Switch Controllability

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Solution Overview

Problem

Conventional semiconductor modules experience degraded switch controllability due to differing signal transmission times for high side and low side switches, caused by unequal lengths of gate wiring lines.

Innovation Solution

The semiconductor module design rearranges control signal terminals to equalize signal line lengths for high side and low side switches by positioning them on opposite sides of the substrate, ensuring identical signal transmission times through strategic bonding wire connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If signal lines for high side and low side switches are disposed on one side of the package, then the structure is simplified, but the gate wiring lines become long and signal transmission times differ between high side and low side switches

Engineering Contradiction:
Improvesignal line arrangement structureVSAvoidsignal transmission time difference
Core Design Contradiction:
Device complexityVSLoss of time

Solution Approach 1:

The patent transitions from a one-sided signal line arrangement to a two-sided arrangement where high side control signals are applied near the power supply side and low side control signals are applied near the ground side. This dimensional change in signal line positioning equalizes the total path lengths for high side and low side gate control signals, eliminating the time difference in signal transmission while maintaining structural simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If gate wiring lines are made shorter to reduce signal transmission time difference, then switch controllability improves, but the wiring structure becomes more complex

Engineering Contradiction:
Improveswitch controllabilityVSAvoidwiring structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of complicating the wiring structure on one side, the patent utilizes the second dimension (opposite side of the package) to position control signal terminals. This allows equal-length gate wiring for both high side and low side switches without increasing structural complexity, as the control signals are applied from different sides of the package rather than routing longer paths on a single side.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11101204B2Semiconductor module
Publication Date: 2021.08.24 SHINDENGEN ELECTRIC MANUFACTURING CO LTD
  • US11101204B2 patent drawing
  • US11101204B2 patent drawing
  • US11101204B2 patent drawing

AI summary

A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.