Semiconductor Module Resin Structure for Terminal Insulation Distance

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Solution Overview

Problem

Conventional semiconductor modules face issues with terminal deformation leading to insufficient insulation distance between the cooling portion and the terminal, which can cause module failure, and require wider spacing, hindering miniaturization.

Innovation Solution

Incorporating a lower side resin that covers part of the terminal's lower surface to secure insulation distance and prevent deformation, using the same material as the sealing resin for enhanced bonding and formed integrally by transfer molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wider spacing is provided between the cooling portion and the terminal to prevent deformation, then reliability is improved, but the module size increases

Engineering Contradiction:

Improveinsulation distanceVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

A resin layer is introduced as an intermediary substance between the terminal and the cooling portion. This resin layer has high insulation properties and prevents terminal deformation, thereby maintaining the required insulation distance without increasing the overall module size. The intermediary resin layer effectively decouples the structural support function from the spatial spacing requirement.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulation properties and mechanical support characteristics are enhanced by changing the material parameters of the resin layer. By selecting resin with appropriate viscosity, curing properties, and mechanical strength, the terminal is prevented from deforming toward the cooling portion, maintaining insulation distance without requiring increased spacing.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If multiple separate materials are used for sealing resin and lower side resin, then functional requirements are met, but manufacturing complexity increases

Engineering Contradiction:

Improveinsulation and sealing performanceVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing resin and lower side resin are merged into a single integrated resin layer. This unified structure performs both sealing and insulation functions simultaneously, eliminating the need for separate application processes and reducing manufacturing complexity. The single resin layer is applied in one continuous operation, simplifying the production workflow.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The resin layer is designed to perform multiple functions simultaneously: it provides sealing protection, electrical insulation, and mechanical support to prevent terminal deformation. This multi-functional design eliminates the need for separate components for each function, reducing both structural complexity and manufacturing steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If separate molding processes are used for sealing resin and lower side resin, then material properties are optimized, but manufacturing time and cost increase

Engineering Contradiction:

Improvematerial performanceVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The transfer molding process for the sealing resin and the lower side resin is merged into a single integrated operation. Both resin portions are molded simultaneously in one process cycle, eliminating the need for separate molding operations. This integration maintains material performance optimization while significantly improving manufacturing efficiency and reducing production time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mold design incorporates preliminary positioning features and gating systems that enable both resin portions to be formed correctly in a single molding cycle. The mold structure is prepared in advance to accommodate the dual-function resin layer, allowing simultaneous formation of both sealing and insulation portions without sequential operations.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents terminal deformation, secures insulation distance, reduces manufacturing costs, and allows for miniaturization of the semiconductor module.

Implementation Method 1

formed integrally by transfer molding

Methodology Applied

Scientific EffectTransfer molding:

Data Source

PatentUS12476158B2Semiconductor module and manufacturing method of semiconductor module

Publication Date: 2025.11.18 FUJI ELECTRIC CO LTD

AI summary

Provided is a semiconductor module, including: a semiconductor chip; a terminal, configured to extend in a extending direction, and be connected electrically with the semiconductor chip; a sealing resin, configured to seal the semiconductor chip, and cover at least a part of an upper surface of the terminal and at least a part of a lower surface of the terminal; and a lower side resin, configured to extend in the extending direction from the sealing resin, and cover at least a part of the lower surface of the terminal, wherein in the extending direction, a length at which the sealing resin and the lower side resin cover the lower surface of the terminal is greater than a length at which the sealing resin covers the upper surface of the terminal in the extending direction; and wherein the sealing resin and the lower side resin are formed of a same material.