Semiconductor Module Thermal Interface State Detection
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Solution Overview
Problem
In semiconductor modules, voids between the semiconductor device and the heat sink due to insufficient thermally conductive material or the pump-out phenomenon lead to inefficient heat transfer, causing elevated operating temperatures and reliability issues.
Innovation Solution
A semiconductor module with a thermally conductive material that softens or melts at a specific temperature, combined with a controller that determines the state of the material based on temperature information from two points, ensuring efficient filling of voids and detection of abnormalities in the heat radiation environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the required amount of grease is applied in the manufacturing process, then the heat transfer should be sufficient, but voids are still generated due to pump-out phenomenon
Solution Approach 1:
The patent changes the physical state parameter of the thermally conductive material by selecting materials that soften or melt at specific temperatures. This transformation allows the material to flow and fill voids created by pump-out phenomenon, maintaining reliable heat transfer despite grease loss over time
Solution Approach 2:
The patent applies a sufficient initial amount of thermally conductive material during manufacturing to compensate for future pump-out phenomenon. The material's softening property provides a buffer that allows it to replenish areas lost to pump-out, cushioning against the reliability degradation that would otherwise occur
2Manufacturing precision
If the thermally conductive material is softened or melted by heat generation, then voids are filled, but constant chip temperature and case temperature cannot be obtained
Solution Approach 1:
The patent performs the void-filling action preliminarily by designing the thermally conductive material to soften and fill voids during an initial heating phase before normal operation. Once voids are filled and the material stabilizes, constant temperatures can be achieved and measured accurately during subsequent operation
Solution Approach 2:
The patent ensures continuous heat transfer by maintaining the thermally conductive material in a softened state that continuously fills voids as they form. This continuous action ensures that heat transfer remains effective throughout operation, allowing stable temperature measurements to be obtained
3Reliability
If irregularities on surfaces are not sufficiently filled with grease, then heat transfer is insufficient, but determining the initial state of thermally conductive material becomes difficult
Solution Approach 1:
The patent uses temperature sensors to provide feedback on the thermal performance of the module. By monitoring chip temperature and case temperature, the system can indirectly assess whether the thermally conductive material is properly filling voids and functioning effectively, simplifying the evaluation process
Solution Approach 2:
The patent replaces complex direct measurement methods for assessing thermally conductive material state with indirect thermal measurements. Instead of mechanically measuring material distribution or void filling, the system uses temperature readings to infer the effectiveness of heat transfer, substituting a simpler measurement approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate determination of the thermally conductive material's state and detection of abnormalities, such as the pump-out phenomenon, thereby maintaining optimal operating temperatures and improving the reliability of the semiconductor module.
Implementation Method 1
grease provided between the power device and the heat sink improves the thermally conductivity from the power device to the heat sink
Implementation Method 2
the thermally conductive material is softened or melted by its heat generation to fill in the voids
Data Source
AI summary
An object is to provide a semiconductor module that ensures to determine a state of the thermally conductive material provided between a semiconductor device and a heat sink. The semiconductor module includes the semiconductor device, the thermally conductive material, and a controller. The thermally conductive material has a property of softening or melting at a specific temperature and is provided on one surface, which is mountable on the heat sink, of the outer surfaces of the semiconductor device. The controller determines the state of the thermally conductive material between the one surface of the semiconductor device and the heat sink based on temperature information on two different points in the semiconductor device.