Semiconductor Module Through-Hole Layout for Thermal Isolation
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Solution Overview
Problem
Existing semiconductor modules face challenges in maintaining thermal stability due to heat transfer between high-thermal-energy emitting devices, which can lead to damage and reduced operating stability.
Innovation Solution
Incorporating through holes in the module substrate that extend between high-thermal-energy emitting devices, with dimensions optimized to block heat transfer while allowing for thermal radiation through thermal radiation layers on the hole walls, thereby preventing heat accumulation and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are added to block heat transfer between devices, then thermal stability is improved, but device complexity increases
Solution Approach 1:
The substrate is segmented by introducing through holes that divide the substrate into separate regions, physically isolating heat sources from heat-sensitive devices. This segmentation blocks thermal conduction paths while maintaining electrical connectivity through separate routing, thereby improving thermal stability without compromising device functionality.
Solution Approach 2:
The through holes act as intermediary thermal barriers between high-thermal-energy emitting devices and heat-sensitive components. By positioning these holes strategically between devices, they serve as thermal mediators that block direct heat transfer paths while allowing the devices to maintain their operational proximity for electrical connectivity.
2Object-affected harmful factors
If through holes are made larger to block more heat, then heat transfer blocking is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the parameters of through holes including their size, shape, and positioning to achieve effective heat blocking. By carefully selecting and adjusting these parameters, the design achieves sufficient thermal isolation while maintaining manufacturability and avoiding excessive precision requirements that would complicate the manufacturing process.
3Loss of energy
If thermal radiation layers are added to through hole walls, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Thermal radiation layers are applied locally to the inner walls of through holes rather than throughout the entire substrate. This localized treatment enhances heat dissipation specifically at the thermal barrier interfaces where it is most needed, while avoiding unnecessary complexity in other regions of the substrate structure.
Solution Approach 2:
The through hole structure becomes a composite system combining the substrate material with thermal radiation layers on its inner surfaces. This composite structure leverages the thermal properties of different materials to simultaneously block direct heat conduction while facilitating thermal radiation-based heat dissipation, improving overall thermal management efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal stability and operating stability by effectively blocking heat transfer between devices and facilitating efficient heat dissipation, allowing for miniaturization and thinning of the semiconductor module.
Implementation Method 1
Incorporating through holes in the module substrate that extend between high-thermal-energy emitting devices, with dimensions optimized to block heat transfer
Implementation Method 2
allowing for thermal radiation through thermal radiation layers on the hole walls
Data Source
AI summary
A semiconductor module includes a module substrate, a controller device and a memory device mounted on a surface of the module substrate, and a plurality of tabs at a side of the module substrate. The module substrate has a first through hole that vertically extends through the module substrate. The first through hole is between the controller device and the memory device. The first through hole extends in a first direction that runs across between the controller device and the memory device. A length along the first direction of the first through hole is less than a width along the first direction of the controller device.