Power Semiconductor Module Layout for Thermal Isolation Balance
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Solution Overview
Problem
Existing semiconductor modules face challenges in efficiently dissipating heat while providing reliable protection against environmental influences, particularly with small die sizes, due to low thermal conductivity of isolation stacks and reliability issues during thermal cycling.
Innovation Solution
A semiconductor module design featuring a heat spreading layer made of electrically and thermally conductive material, with power semiconductor devices connected via low-temperature sintering, and an electrical isolation stack for insulation, enclosed in a mold to enhance thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic isolation stack is used to electrically insulate semiconductor devices from the environment, then electrical protection is improved, but thermal conductivity deteriorates
Solution Approach 1:
The module is divided into distinct functional layers: a baseplate for thermal management, a ceramic isolation stack for electrical insulation, and a mold for environmental protection. This segmentation allows each layer to optimize its specific function without compromising others.
Solution Approach 2:
The patent introduces a mold as an intermediary component that encapsulates the ceramic isolation stack and semiconductor devices. This mold provides an additional thermal management pathway and environmental protection, mediating between the electrical insulation requirement and thermal dissipation need.
2Reliability
If silicone gel is applied to protect semiconductor devices from moisture and contaminants, then electrical protection is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent employs a mold encapsulation that provides robust environmental protection without relying on thermal conductive gels. The mold acts as a permanent protective barrier that does not degrade thermally, replacing the need for thermal conductive silicone gel.
3Temperature
If the thickness of the heat spreading layer is increased to improve heat dissipation, then thermal conductivity is improved, but device complexity increases
Solution Approach 1:
The baseplate serves multiple functions simultaneously: it acts as a heat spreading layer for thermal management, provides mechanical support for the ceramic isolation stack, and serves as a mounting surface for semiconductor devices. This multi-functionality reduces the need for additional components.
Solution Approach 2:
The patent merges the baseplate and heat spreading layer into a single integrated component. This consolidation simplifies the module structure by eliminating the need for separate heat spreading layers while maintaining effective thermal dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves thermal conductivity and reliability by efficiently transporting heat to the environment, reducing thermal resistance, and increasing module durability through separate power terminal connections to the heat spreading layers.
Implementation Method 1
a heat spreading layer with a first surface and a second surface being arranged opposite to the first surface... efficiently transporting heat to the environment... improving thermal conductivity
Implementation Method 2
an electrical isolation stack comprising electrically conductive layers and electrically insulating layer... which electrically insulates the semiconductor devices from the environment
Implementation Method 3
power semiconductor devices... electrically connected thereto by low temperature sintering, soldering or other similar methods
Data Source
AI summary
A module arrangement for power semiconductor devices, includes two or more heat spreading layers with a first surface and a second surface being arranged opposite to the first surface. At least two or more power semiconductor devices are arranged on the first surface of the heat spreading layer and electrically connected thereto. An electrical isolation stack comprising an electrically insulating layer and electrically conductive layers is arranged in contact with the second surface of each heat spreading layer. The at least two or more power semiconductor devices, the heat spreading layers and a substantial part of each of the electrical isolation stacks are sealed from their surrounding environment by a molded enclosure. Accordingly, similar or better thermal characteristic of the module can be achieved instead of utilizing high cost electrically insulating layers, and double side cooling configurations can be easily implemented, without the use of a thick baseplate.