Semiconductor Module Protective Cover for Thermal Interface Integrity
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Solution Overview
Problem
In semiconductor module systems, heat dissipation surfaces often have significant irregularities and differing thermal expansion coefficients, leading to inefficient heat transfer and risk of thermal interface material contamination during transport and mounting, especially for larger modules.
Innovation Solution
A semiconductor module system with a protective cover that can be irreleasably mounted over the heat dissipation surface, allowing for structured or unstructured application of thermal interface material, which is protected from external effects until the module is mounted on a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface material is applied onto the heat dissipation surface, then heat transfer resistance is reduced, but the thermal interface material may be smeared and/or contaminated during transport and mounting
Solution Approach 1:
The patent introduces a protective cover as an intermediary element between the thermal interface material and the external environment. This cover protects the applied thermal interface material from smearing and contamination during transport and mounting operations, while allowing the thermal interface material to maintain its intended function once the module is mounted on the heat sink
2Ease of operation
If the semiconductor module is transported with applied thermal interface material to the end customer, then the module can be mounted directly, but the risk of smearing and/or contamination increases
Solution Approach 1:
The protective cover serves as a mediator that enables the module to be transported with pre-applied thermal interface material without risk of contamination. The cover can be easily removed at the mounting location, maintaining ease of operation while preventing harmful effects during transport
3Area of stationary object
If larger heat dissipation surfaces are used, then cooling capacity is increased, but surface irregularity and bending increase
Solution Approach 1:
The patent applies the thermal interface material in a controlled manner before mounting, and uses a protective cover to preserve the applied material's integrity. This preliminary action ensures that even with larger surfaces that may have irregularities, the thermal interface material is properly positioned and protected until mounting occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency by protecting the thermal interface material and preventing contamination, allowing for reliable and efficient mounting of semiconductor modules on heat sinks while maintaining the integrity of the thermal interface material.
Implementation Method 1
a thermal interface material (TIM) which compensates for the existing nonplanarities is conventionally used
Implementation Method 2
the protective cover covers the heat dissipation surface
Data Source
AI summary
A semiconductor module system has a semiconductor module and a protective cover. The semiconductor module has a bottom side with a heat dissipation surface and a top side opposite the bottom side, the top side being separated from the bottom side in a vertical direction. The protective cover can be mounted irreleasably on the semiconductor module in such a way that, in a mounted state, the top side is exposed and the protective cover covers the heat dissipation surface. By virtue of the protective cover, a thermal interface material applied onto the heat dissipation surface can be protected.