Semiconductor Module Cooling Structure to Prevent TIM Pump-Out
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Solution Overview
Problem
The existing power conversion apparatus with a double-sided cooling structure faces issues of increased thermal resistance and decreased insulation quality due to the potential pump-out of thermal interface materials (TIMs), which affects reliability and increases costs.
Innovation Solution
A power conversion apparatus with a semiconductor module molded by resin, incorporating a semisolid thermal conductive material and a heat dissipation member, featuring a stepped portion to prevent TIM pump-out and ensure effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal interface material (TIM) is disposed between the power conversion apparatus and cooling water channel, then heat dissipation is improved, but the TIM may pump out causing thermal resistance to increase and insulation quality to decrease
Solution Approach 1:
The patent introduces a stepped portion structure that creates a vertical dimension barrier, preventing the TIM from moving horizontally toward the cooling water channel. This dimensional change in the structural arrangement effectively stops the pump-out effect while maintaining thermal contact.
Solution Approach 2:
The stepped portion is designed in advance to counteract the pump-out effect before it can occur. By creating a physical barrier at the interface, the structure prevents the TIM from being pushed out during operation, thereby maintaining both thermal performance and insulation quality throughout the device's lifecycle.
2Temperature
If a thermal interface material (TIM) is disposed between the power conversion apparatus and cooling water channel, then heat dissipation is improved, but cost increases
Solution Approach 1:
The patent combines the TIM retention function with the existing structural components by forming a stepped portion within the housing or mounting structure. This integration eliminates the need for separate retention mechanisms or specialized TIM formulations, thereby reducing overall manufacturing cost while maintaining effective heat dissipation.
3Temperature
If a thermal interface material (TIM) is disposed between the power conversion apparatus and cooling water channel, then heat dissipation is improved, but productivity decreases
Solution Approach 1:
The stepped portion structure is pre-formed during housing manufacturing or assembly preparation, creating a built-in TIM retention feature before the actual assembly process. This preliminary action eliminates the need for additional steps to secure the TIM during assembly, thereby maintaining high productivity while ensuring effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves cost reduction, improved productivity, and enhanced reliability by preventing TIM pump-out and maintaining insulation quality while efficiently dissipating heat through the use of semisolid thermal conductive materials and cooling water channels.
Implementation Method 1
a thermal conductive material having a semisolid shape that is disposed in contact with the heat exchanger plate and covering one surface of the semiconductor module; and a heat dissipation member that dissipates heat from the semiconductor module through the thermal conductive material
Data Source
AI summary
A power conversion apparatus includes: a semiconductor element; a heat exchanger plate connected to the semiconductor element; a semiconductor module formed by molding the semiconductor element and the heat exchanger plate with resin; a thermal conductive material having a semisolid shape that is disposed in contact with the heat exchanger plate and covering one surface of the semiconductor module; and a heat dissipation member that dissipates heat from the semiconductor module through the thermal conductive material.