Semiconductor Module Terminal Layout for Compact Vertical Bonding
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Solution Overview
Problem
There is a demand for energy-saving, sophisticated, and smaller electronic devices, which requires improved performance and reduced size of semiconductor modules.
Innovation Solution
A semiconductor module configuration featuring a conductive substrate, semiconductor elements with switching functions, control terminals, and sealing resin, where the control terminal protrudes and extends along the thickness direction, allowing for efficient bonding and size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor module configurations are used, then manufacturing and assembly are straightforward, but the module size cannot be sufficiently reduced
Solution Approach 1:
The control terminal is configured to extend in the thickness direction (vertical dimension) rather than only in the planar direction, utilizing the third dimension to reduce the footprint area while maintaining functional performance. This dimensional transition allows the terminal to protrude from the resin obverse surface, achieving compactness without compromising electrical connection capability.
Solution Approach 2:
The control terminal is embedded within the sealing resin structure, with the resin covering the conductive substrate, semiconductor element, and part of the control terminal. This nesting approach integrates the control terminal into the module's encapsulation structure, optimizing space utilization and reducing overall module volume.
2Productivity
If the control terminal extends along the thickness direction, then bonding efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The control terminal is pre-configured with a specific extension direction (thickness direction) and positioning relative to the conductive substrate before the sealing resin is applied. This preliminary positioning ensures that subsequent bonding operations can proceed efficiently with standardized procedures, reducing the actual manufacturing complexity despite the three-dimensional configuration.
Data Source
AI summary
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.