Semiconductor Module Layout With Vertical Control Terminals
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Solution Overview
Problem
There is a demand for energy-saving, sophisticated, and smaller electronic devices, necessitating improvements in the performance and size reduction of semiconductor modules.
Innovation Solution
A semiconductor module configuration featuring a conductive substrate with a semiconductor element bonded to its obverse surface, a control terminal protruding along the thickness direction, and covered by a sealing resin, which extends to cover the conductive substrate, semiconductor element, and part of the control terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional semiconductor module configurations are used, then reliability is maintained, but size reduction and performance improvement are limited
Solution Approach 1:
The patent transitions from a planar arrangement where control terminals are confined to the surface to a three-dimensional configuration where control terminals protrude vertically from the sealing resin surface. This dimensional change allows for better spatial utilization, improved electrical connection reliability, and enhanced performance while maintaining a compact overall module size.
Solution Approach 2:
The control terminals are nested within the sealing resin structure, with the resin covering the conductive substrate and semiconductor element while allowing the control terminals to protrude. This nesting approach protects the internal components while providing accessible external terminals, optimizing both protection and functionality.
2Reliability
If the control terminal is fully covered by sealing resin, then protection is improved, but electrical connection and controllability are worsened
Solution Approach 1:
The sealing resin is applied selectively to cover only the portions of the control terminals that require protection, while leaving the terminal ends exposed for electrical connection. This localized sealing approach ensures that each part of the control terminal receives the appropriate treatment - protection where needed and accessibility where required.
3Volume of moving object
If the module size is reduced, then integration is improved, but heat dissipation and performance are worsened
Solution Approach 1:
The module is segmented into distinct functional zones with the control terminals separated and protruding from the sealing resin. This segmentation allows for optimized thermal management by separating the control signal path from the power handling components, enabling better heat dissipation pathways while maintaining a compact overall structure.
Data Source
AI summary
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.