Power Semiconductor Module Vibration Dampeners for PCB Stability

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Solution Overview

Problem

Power semiconductor modules face issues with PCB vibration modes that can lead to failure or other problems within the power electronics system due to inadequate vibration control.

Innovation Solution

The integration of vibration dampeners attached to the lead frame or clip frame of the power semiconductor module, which protrude through the enclosure separate from the electrical connection interface, effectively dampen vibrations at the circuit board without affecting electrical operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vibration dampeners are added to the power semiconductor module, then PCB vibration is reduced, but device complexity increases

Engineering Contradiction:

ImprovePCB vibration controlVSAvoidmodule structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The vibration dampeners are integrated within the existing power semiconductor module structure, nested between the lead frame and the PCB mounting interface. This allows the vibration damping function to be incorporated without adding external components, thereby reducing the impact on device complexity while achieving vibration control.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The vibration dampening function is merged with the existing electrical connection structure by attaching dampeners to the lead frame, which already serves as an electrical conductor and structural element. This combination allows a single component to serve dual purposes: electrical connection and vibration damping.

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If vibration dampeners are integrated into the power semiconductor module, then PCB stability is improved, but manufacturing complexity increases

Engineering Contradiction:

ImprovePCB stabilityVSAvoidassembly process

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The vibration dampeners are pre-attached to the lead frame during module manufacturing, before the final assembly with the PCB. This preliminary action allows the dampeners to be integrated into the module as a standard component, simplifying the overall manufacturing process by avoiding post-assembly installation steps.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If vibration dampeners protrude through the enclosure, then vibration damping effectiveness is improved, but electrical connection interface complexity increases

Engineering Contradiction:

Improvevibration damping effectivenessVSAvoidconnection interface

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The vibration dampening function is extracted as a separate component attached to the lead frame, distinct from the electrical connection pins. This extraction allows the dampeners to protrude through the enclosure for effective vibration damping while maintaining a clear separation between electrical connection elements and vibration control elements, thereby managing interface complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vibration dampeners reduce PCB vibrations, ensuring the stability and reliability of the power semiconductor module and power electronics system by preventing failure and maintaining electrical functionality.

Implementation Method 1

a plurality of vibration dampeners attached to the lead frame or clip frame and protruding through the first side of the electrically insulative enclosure separate from the electrical connection interface, wherein the plurality of vibration dampeners is configured to dampen vibrations at a circuit board

Methodology Applied

Scientific EffectVibration damping: Damping

Data Source

PatentUS12463148B2Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module

Publication Date: 2025.11.04 INFINEON TECHNOLOGIES AG

AI summary

A power semiconductor module includes: an electrically insulative enclosure; a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure; a lead frame or clip frame disposed above the power semiconductor dies inside the electrically insulative enclosure and electrically connected to the power semiconductor dies; a plurality of contact pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure; and a plurality of vibration dampeners attached to the lead frame or clip frame. The vibration dampeners protrude through the first side of the electrically insulative enclosure and are separate from the electrical connection interface. The vibration dampeners are configured to dampen vibrations at a circuit board designed to be mounted to the module and do not affect electrical operation of the power semiconductor module.