Semiconductor Module Sealing Structure to Suppress Voids
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Solution Overview
Problem
The sealing of electronic components with power semiconductor elements in semiconductor modules often results in narrow spaces leading to void generation and reduced reliability.
Innovation Solution
A semiconductor module design featuring power semiconductor elements arranged in parallel, bonded to conductor plates with recesses or through holes on the wiring substrate, allowing for effective sealing without voids and enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are sealed together with power semiconductor elements in a narrow space, then the module size is reduced, but voids are generated and reliability deteriorates
Solution Approach 1:
The invention introduces a vertical dimension by forming recesses in the conductor plate, transforming the sealing space from a two-dimensional planar configuration to a three-dimensional structure. This allows the sealing member to flow into the recesses, ensuring complete filling without voids while maintaining compact module dimensions.
Solution Approach 2:
The recesses are formed in the conductor plate before the sealing process. This preliminary action creates pre-defined flow paths and storage spaces for the sealing member, ensuring that the sealing material can properly fill the sealing space without generating voids during the sealing operation.
2Adaptability or versatility
If electronic components are mounted on the wiring substrate, then the module functionality is enhanced, but the sealing space becomes narrower causing void generation
Solution Approach 1:
By forming recesses in the conductor plate, the invention creates additional vertical space above the wiring substrate. This allows electronic components to be mounted on the wiring substrate while the sealing member can flow into the recesses, ensuring complete filling and uniform sealing without voids.
Solution Approach 2:
The recesses act as an intermediary structure between the wiring substrate with mounted components and the sealing member. They provide a transition space that accommodates both the electronic components and the sealing material, ensuring proper sealing without direct conflict between components and sealant.
3Reliability
If the module thickness is increased to accommodate sealing space, then void generation is suppressed, but the module size increases
Solution Approach 1:
The recesses are formed within the conductor plate structure itself, nesting the sealing space inside the existing module components. This eliminates the need to increase overall module thickness, as the sealing member flows into the recesses that are already part of the conductor plate's internal structure.
Solution Approach 2:
Instead of uniformly increasing the entire module thickness, the invention locally modifies the conductor plate by forming recesses only in specific regions where sealing space is needed. This maintains compact overall dimensions while providing adequate sealing space locally where electronic components are mounted.
Data Source
AI summary
A semiconductor module includes: a plurality of power semiconductor elements arranged in parallel to each other; a first conductor plate and a second conductor plate respectively bonded to an upper surface and a lower surface of the power semiconductor elements arranged in parallel to each other; a wiring substrate provided on the second conductor plate; and an electronic component mounted on the wiring substrate, the power semiconductor elements, the first conductor plate, the second conductor plate, the wiring substrate, and the electronic component being sealed with a sealing member. The first conductor plate positioned on the upper surface side of the wiring substrate has at least one of a recess and a through hole in a region facing with the electronic component on the wiring substrate.