Semiconductor Module Sealing Structure Against Water Infiltration
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Solution Overview
Problem
Conventional semiconductor modules packaged with sealing resin are susceptible to water infiltration through the space between the sealing resin and the substrate, leading to reduced connection strength and operation reliability.
Innovation Solution
The semiconductor module incorporates bump electrodes or substrate electrodes that protrude from the wiring layer or substrate and are embedded in the sealing resin, acting as barriers to prevent water infiltration, and may be integrated with a metallic foil for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing resin is used to package the semiconductor device, then the device is protected and sealed, but water can still infiltrate through the space between the sealing resin and substrate, reducing connection strength and reliability
Solution Approach 1:
A bump structure is introduced as an intermediary element between the sealing resin and the substrate. This bump protrudes into the sealing resin and creates a physical barrier that interrupts the water infiltration path, preventing water from reaching the bonding interface between the substrate and semiconductor device.
Solution Approach 2:
The sealing structure is segmented by the bump protrusion, which divides the continuous space between the sealing resin and substrate into separate regions. This segmentation creates a stepped structure that blocks water from traveling directly along the interface, effectively preventing water infiltration while maintaining the sealing function.
2Volume of moving object
If the semiconductor module uses a compact CSP (Chip Size Package) design, then board density is improved and size is reduced, but water infiltration risk increases due to smaller clearance and tighter packaging
Solution Approach 1:
The bump structure is strategically positioned at specific locations where water infiltration is most likely to occur, such as along the periphery or at critical bonding regions. This localized approach provides targeted water blocking without requiring a complete redesign of the entire package structure, maintaining compact CSP dimensions while enhancing water resistance at critical points.
Data Source
AI summary
A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.