Semiconductor Module Planar Relay Plate Layout for Wire Sag Control
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Solution Overview
Problem
Existing semiconductor modules face issues with bonding wire sagging and sweep due to three-dimensional wiring structures, leading to increased module thickness and size.
Innovation Solution
A semiconductor module design featuring a base plate, relay plate, and terminal member arranged on the same plane with gaps, connected by bonding wires, reducing wire sagging and sweep, and minimizing mold resin thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a three-dimensional wiring structure with a relay wire member disposed on the base plate is used, then wire sagging and wire sweep are inhibited, but the height of the bonding wire loop is increased, resulting in increased mold resin thickness and module size
Solution Approach 1:
The patent transitions from a three-dimensional wiring structure to a planar two-dimensional wiring structure. The relay wire member is repositioned from a raised position on the base plate to the same plane as the base plate, creating a flat configuration that eliminates wire loop height while maintaining electrical connection functionality. This dimensional reduction directly addresses the contradiction by preventing wire sagging in the planar arrangement while reducing module thickness.
Solution Approach 2:
The patent extracts the vertical height component from the wiring structure by removing the relay wire member's elevation above the base plate. The relay wire member is kept minimal and coplanar, extracting only the essential electrical connection function while eliminating the volume-consuming vertical dimension. This allows wire sagging prevention through proper wire routing without the penalty of increased module size.
2Device complexity
If bonding wires are connected directly between electronic components and terminal members, then the wiring structure is simplified, but wire sagging and wire sweep occur due to excessive wire length
Solution Approach 1:
The patent introduces a relay wire member as an intermediary element in the wiring structure. This relay wire member serves as a intermediate connection point that breaks the direct long wire path into shorter segments. The relay wire member is positioned on the same plane as the base plate, acting as a mediator that enables reliable wire connections without requiring excessive wire length, thus preventing wire sagging and sweep while maintaining structural simplicity.
3Volume of moving object
If the mold resin thickness is reduced to minimize module size, then manufacturing costs are reduced, but wire sagging and wire sweep become more likely to occur
Solution Approach 1:
The patent adopts a planar wiring arrangement where all components (base plate, relay wire member, terminal members) are positioned on the same plane. This two-dimensional configuration eliminates the need for vertical wire loops that would require thick mold resin for support. The wire connections are made within the plane, allowing thin mold resin thickness while preventing wire sagging through proper planar wire routing and tension control.
Data Source
AI summary
The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire.