Semiconductor Module Wiring Inductance Reduction
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Solution Overview
Problem
Existing semiconductor modules fail to sufficiently reduce wiring pattern inductance, leading to surge voltage damage to semiconductor elements during switching operations.
Innovation Solution
A semiconductor module design featuring a semiconductor element with a first terminal and a second terminal with multiple wiring portions, where connection lines extend in multiple directions and form current paths of the same potential, incorporating a free region to minimize wiring inductance, and a power conversion device that includes this module with a main conversion circuit and control circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring patterns are used in semiconductor modules, then the structure is simple and easy to manufacture, but the wiring inductance is high which causes surge voltage to damage semiconductor elements
Solution Approach 1:
The second terminal is divided into multiple wiring portions (first wiring portion, second wiring portion, third wiring portion) instead of a single continuous trace. This segmentation allows the current path to be distributed across multiple separate regions, reducing the overall inductance by creating parallel current flow paths and minimizing loop area.
Solution Approach 2:
The wiring pattern transitions from a conventional two-dimensional planar layout to a three-dimensional structure by having connection lines extend vertically from the upper face of the semiconductor element to multiple wiring portions at different spatial locations. This vertical dimensionality reduces the horizontal current path length and inductance.
2Object-affected harmful factors
If wiring pattern inductance is reduced through terminal array revision, then surge voltage is reduced, but the manufacturing complexity and design complexity increase
Solution Approach 1:
Multiple wiring portions are electrically connected through connection lines that extend from the semiconductor element, effectively merging multiple current paths into a unified electrical connection system. This combining approach maintains low inductance while simplifying the manufacturing process by using standard connection techniques.
Solution Approach 2:
Different regions of the terminal structure are assigned different functions: the first terminal provides mounting functionality, the second terminal with multiple wiring portions provides low-inductance current paths, and the connection lines provide vertical connectivity. This local optimization of quality allows each region to contribute specifically to reducing surge voltage without compromising manufacturability.
Data Source
AI summary
The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.