Semiconductor Module Wiring Layout for Lower Resistance and Heat
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Solution Overview
Problem
Existing semiconductor modules require significant wiring space on the side of the module, limiting downsizing and increasing wiring resistance and heat generation.
Innovation Solution
A semiconductor module design with a common wiring electrode exposed on one side and non-common wiring electrodes, allowing vertical connection without electrical connection to non-common wiring, reducing wiring space and resistance, and using a high-heat radiation resin mold for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wiring layout is used in semiconductor modules, then wiring space is sufficient for connections, but wiring resistance increases and heat generation worsens
Solution Approach 1:
The patent transitions from planar wiring layout to three-dimensional wiring structure by extending wiring electrodes vertically through the resin mold. The common wiring electrode and non-common wiring electrode are positioned at different heights and connected to semiconductor elements from opposite sides, utilizing the vertical dimension to reduce wiring length and resistance while minimizing occupied surface area.
Solution Approach 2:
The wiring electrodes are nested within the resin mold structure, with the common wiring electrode and non-common wiring electrode arranged in a nested configuration where one wiring structure is positioned inside or adjacent to another, optimizing space utilization and reducing overall wiring volume.
2Volume of moving object
If wiring space is reduced for module downsizing, then module size decreases, but heat dissipation becomes more difficult
Solution Approach 1:
The resin mold serves as a thermal intermediary with high heat radiation properties, conducting heat away from the semiconductor elements and wiring structures. The mold material acts as a heat sink and radiation source, efficiently transferring thermal energy from the compact internal components to the external environment.
Solution Approach 2:
The resin mold is formulated as a composite material combining polymer matrix with heat-conductive fillers or radiation-enhancing additives, providing both structural encapsulation and superior thermal management properties in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces wiring space, lowers resistance, and suppresses heat generation, contributing to module downsizing and efficient heat management.
Implementation Method 1
high-heat radiation resin mold for improved heat dissipation
Data Source
AI summary
A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.