Semiconductor Module Wiring Protection Layer Moisture Shielding
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Solution Overview
Problem
Conventional semiconductor modules face reliability issues due to moisture infiltration through insulating resins, leading to corrosion and separation of layers, which affects the connection between bump electrodes and device electrodes, especially when exposed to high humidity and thermal stress during manufacturing.
Innovation Solution
A semiconductor module design featuring a wiring protection layer that shields the insulating resin layer, with a rough surface structure to enhance adhesion and prevent moisture infiltration, and a manufacturing method that includes pressure-bonding and selective removal of dummy bumps to form a reliable connection between bump electrodes and device electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating resin is used to connect wiring and semiconductor device, then electrical insulation and structural support are provided, but moisture infiltration occurs through the resin leading to corrosion and connection failure
Solution Approach 1:
A sealing structure comprising a first sealing member and a second sealing member is introduced as an intermediary barrier between the insulating resin and the external environment. The first sealing member fills the gap between the wiring and the semiconductor device, while the second sealing member fills the gap between the insulating resin and the wiring protection layer, collectively preventing moisture infiltration pathways
Solution Approach 2:
The sealing members function as thin film barriers that conform to the interfaces between different structural layers. These flexible sealing films adapt to the geometry of the gaps and provide continuous moisture protection without rigid structural constraints
2Ease of manufacture
If insulating resin is exposed on module surfaces, then manufacturing is simplified, but moisture infiltration through exposed resin and layer interfaces increases
Solution Approach 1:
The second sealing member acts as a thin film barrier that covers the interface between the insulating resin and the wiring protection layer, sealing the exposed resin surfaces without requiring complex encapsulation structures
Solution Approach 2:
The sealing members serve as intermediary protective layers that bridge the gap between the simplified exposed resin structure and the need for moisture protection, allowing the resin to remain exposed for manufacturing ease while preventing moisture access
3Reliability
If moisture infiltrates through insulating resin, then none, but corrosion of metal members and separation of layers occur reducing reliability
Solution Approach 1:
The sealing members are installed in advance to prevent moisture infiltration before corrosion and separation can occur. This proactive sealing approach cushions the metal members and layer interfaces against moisture exposure, preventing the chain of harmful effects before they initiate
Data Source
AI summary
A semiconductor module includes: an insulating resin layer; a wiring layer which is provided on one main surface of the insulating resin layer and which includes an external connection region; bump electrodes which are electrically connected to the wiring layer and each of which is formed such that it protrudes from the wiring layer toward the insulating resin layer; a semiconductor device which is provided on the other main surface of the insulating resin layer and which includes device electrodes connected to the bump electrode; and a wiring protection layer provided on the wiring layer and the insulating resin layer so as to expose the external connection region. In the semiconductor module, the outer edge portion of the wiring protection layer is in contact with the external edge portion of the semiconductor device such that it shields at least a part of the semiconductor resin layer at the side edge.