Semiconductor Module Substrate Layout Without Spacers
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Solution Overview
Problem
Semiconductor modules with double-sided heat dissipation structures face issues such as misalignment, bonding failures, and reduced yield due to the use of spacers, which also lead to flatness problems and increased manufacturing costs.
Innovation Solution
A semiconductor module design that eliminates the need for spacers by using substrates with varying thickness patterns and conductive frames to secure spacing between substrates, allowing direct bonding of semiconductor devices to circuit patterns, thereby simplifying the manufacturing process and improving flatness and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spacers are used to secure spacing and electrical connection between semiconductor devices and substrates, then the double-sided heat dissipation structure can be formed, but misalignment during bonding, bonding failures due to height deviations, and reduced yield occur
Solution Approach 1:
The patent removes the spacer component entirely from the system. Instead of using separate spacers for spacing and electrical connection, the substrate itself is designed with integrated circuit patterns that provide both functions. The spacing is achieved through thickness variations in the substrate patterns, while electrical connections are established through conductive traces formed directly on the substrate surface, eliminating the need for additional spacer components and their associated bonding processes.
Solution Approach 2:
The patent combines multiple functions into the substrate structure itself. The substrate patterns serve dual purposes: providing mechanical spacing between components and establishing electrical connections. By integrating the spacing function and electrical connection function into the substrate design, the patent eliminates the need for separate spacer components, thereby reducing the number of bonding steps and improving alignment precision.
2Reliability
If spacers are used for each semiconductor device to compensate thickness deviation, then spacing can be secured, but the number of bonding processes increases and productivity decreases
Solution Approach 1:
The substrate is designed to perform multiple functions simultaneously. The circuit patterns on the substrate provide both mechanical support and spacing, while also establishing electrical connections. This multi-functional design eliminates the need for separate spacer components for each device, reducing the number of bonding processes required and improving manufacturing efficiency while maintaining spacing stability.
Solution Approach 2:
The substrate is divided into multiple patterns with different thicknesses to accommodate different spacing requirements for various semiconductor devices. Each pattern can be independently optimized for its specific function, allowing the substrate to provide precise spacing control without requiring individual spacers for each device, thereby reducing the overall number of bonding steps.
3Productivity
If substrates with varying thickness patterns are used to eliminate spacers, then the manufacturing process is simplified and productivity is improved, but the substrate design complexity increases
Solution Approach 1:
The substrate is designed with local variations in thickness and conductivity tailored to specific regions. Different areas of the substrate have optimized properties for their specific functions, such as thicker regions for spacing and conductive traces for electrical connections. This localized optimization allows the substrate to perform multiple functions without requiring a uniformly complex design throughout, balancing manufacturing simplicity with functional requirements.
4Reliability
If additional bonding members and spacers are used, then electrical connection and spacing are ensured, but manufacturing costs increase
Solution Approach 1:
The patent combines the electrical connection function and spacing function into the substrate structure itself. Circuit patterns formed directly on the substrate provide both electrical pathways and mechanical spacing, eliminating the need for separate bonding members and spacers. This integration reduces the total number of components and assembly steps, thereby lowering manufacturing costs while ensuring reliable electrical connections.
Data Source
AI summary
A semiconductor module according to the present disclosure includes a first substrate having a plurality of patterns having two or more different thickness, a first semiconductor device disposed on at least one or more patterns, a second substrate having a plurality of patterns having two or more different thickness. One or more of the plurality of patterns of the second substrate is placed on the first semiconductor device, a first terminal pattern and a second terminal pattern, each disposed between the first substrate and the second substrate, the first terminal pattern comprises a first upper terminal pattern and a first lower terminal pattern, and the second terminal pattern comprises a second upper terminal pattern and a second lower terminal pattern, and a conductive frame coupled to at least one of the first and the second terminal patterns.