Semiconductor Module Layout With Y Capacitor Noise Cancellation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor modules face challenges in suppressing noise, particularly common mode noise, due to the lack of effective noise reduction mechanisms.
Innovation Solution
The semiconductor module incorporates a Y capacitor disposed on the substrate's front surface between the front-surface ground wiring and the front-surface main wiring, with the semiconductor package and Y capacitor oriented such that their electric currents flow in opposite directions, canceling out magnetic fields and reducing parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional semiconductor module configuration is used, then the structure is simple, but common mode noise and switching surge are generated
Solution Approach 1:
The patent positions the Y capacitor and semiconductor package to face each other with opposite current directions, converting the potentially harmful magnetic fields into beneficial canceling fields. This arrangement transforms the electromagnetic interference problem into a solution where the magnetic fields neutralize each other, reducing common mode noise without requiring additional noise suppression components
Solution Approach 2:
The Y capacitor serves as an intermediary element between the ground wiring and main wiring, providing a controlled path for high-frequency noise current. By positioning it to face the semiconductor package, it mediates the electromagnetic interaction between power and ground paths, enabling magnetic field cancellation and noise reduction
2Object-affected harmful factors
If a Y capacitor is added to reduce noise, then common mode noise is suppressed, but the device complexity increases
Solution Approach 1:
The Y capacitor is positioned to serve multiple functions simultaneously: it provides high-frequency noise suppression between ground and main wiring, and its specific orientation enables magnetic field cancellation with the semiconductor package. This multi-functionality allows a single component to address both noise suppression and electromagnetic interference reduction without requiring additional dedicated components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces common mode noise and switching surge, thereby suppressing noise generation and improving the overall performance of the semiconductor module.
Implementation Method 1
The semiconductor package and the Y capacitor are disposed in such a manner that a direction of electric current flowing in the semiconductor package and a direction of electric current flowing in the Y capacitor are opposite to each other
Data Source
AI summary
A semiconductor module includes a substrate, a semiconductor package disposed to the substrate, a housing to which the substrate is fixed, and a Y capacitor. A front-surface wiring in the substrate includes a front-surface ground wiring electrically connected to the housing, and a front-surface main wiring connected to a rear-surface wiring that is connected to the semiconductor package. The Y capacitor is disposed on a front surface of the substrate at a position facing the semiconductor package and between the front-surface ground wiring and the front-surface main wiring. The semiconductor package and the Y capacitor are disposed in such a manner that a direction of electric current flowing in the semiconductor package and a direction of electric current flowing in the Y capacitor are opposite to each other.