Semiconductor Moisture Barrier and Redistribution Layer
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Solution Overview
Problem
Packaged semiconductor devices are vulnerable to moisture exposure, which can lead to short circuits and component degradation due to permeable or cracked dielectric materials, necessitating an effective moisture barrier to prevent seepage and protect electrical circuits.
Innovation Solution
A semiconductor structure with a moisture barrier surrounding the devices and a metal conductive redistribution layer forming a closed compartment, utilizing copper for enhanced moisture protection and electrical conductivity, thereby isolating and shielding the semiconductor devices from environmental moisture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric materials are used to provide isolation and protection, then electrical isolation is improved, but moisture barrier protection deteriorates due to permeability and cracking
Solution Approach 1:
The patent employs a composite structure combining dielectric layers with a metallic moisture barrier layer. The dielectric layers (such as silicon nitride and BCB) provide electrical isolation, while the embedded copper or aluminum moisture barrier layer provides impermeable protection against moisture. This composite approach allows both electrical isolation and moisture barrier functions to coexist without compromising either.
Solution Approach 2:
The moisture barrier layer acts as an intermediary between the dielectric layers and the external environment. It is embedded within the dielectric structure, specifically positioned to block moisture paths while allowing the dielectric materials to maintain their electrical isolation function. The barrier layer mediates the conflict between dielectric permeability and moisture protection by providing a dedicated protective pathway.
2Object-affected harmful factors
If a moisture barrier is added to prevent moisture ingress, then protection against moisture is improved, but device complexity increases
Solution Approach 1:
The moisture barrier function is merged with the existing dielectric layer structure. Rather than adding a separate external moisture barrier, the copper or aluminum barrier layer is integrated within the dielectric stack during the same fabrication process. This merging approach provides moisture protection while minimizing additional structural complexity and process steps.
Solution Approach 2:
The metallic barrier layer serves multiple functions simultaneously: it acts as a moisture barrier, provides electrical grounding paths, and can serve as part of the conductive redistribution layer. This multi-functionality reduces the need for separate dedicated moisture barrier structures, thereby limiting the increase in device complexity.
3Reliability
If dielectric layers are used for isolation, then electrical protection is improved, but thermal management deteriorates due to limited thermal conductivity
Solution Approach 1:
The patent creates a composite thermal management system where the metallic moisture barrier layer (copper or aluminum) serves dual purposes: blocking moisture and conducting heat. These high thermal conductivity metal layers are strategically positioned within the dielectric structure to create thermal pathways, while the dielectric materials maintain their electrical isolation function. This composite approach allows heat to be conducted away from sensitive regions without compromising electrical protection.
Data Source
AI summary
A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.