Semiconductor Device Moisture Resistance and Dicing Productivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional CSP semiconductor devices face challenges with poor moisture resistance due to hygroscopic materials in the protection film and adhesive layer, leading to reliability issues and increased dicing time, especially when using rigid supporters like glass substrates.
Innovation Solution
A semiconductor device design featuring a metal pad, insulation film, and a multi-layer protection structure with conductive terminals, where the protection layer is formed to fill the space over the semiconductor die and supporter, enhancing moisture resistance and allowing for simultaneous dicing of multiple devices by reducing the supporter's thickness and eliminating the need for individual dicing along each line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional protection film and adhesive layer are used, then the semiconductor device can be manufactured, but moisture resistance is poor due to hygroscopic materials causing reliability issues
Solution Approach 1:
The patent removes the conventional protection film and adhesive layer from the structure. Instead, it uses a supporter with through-holes that directly exposes the semiconductor substrate, eliminating the hygroscopic materials that cause moisture absorption and reliability issues.
Solution Approach 2:
The supporter is designed with through-holes at specific locations where dicing is performed, while maintaining structural integrity in other areas. This localized modification allows direct exposure of the semiconductor substrate only where necessary, preventing moisture ingress at critical bonding interfaces.
2Productivity
If individual dicing along each line is performed, then precise separation is achieved, but dicing time increases significantly
Solution Approach 1:
The supporter is segmented with through-holes at predetermined locations corresponding to dicing lines. These holes allow the dicing blade to pass through and separate multiple semiconductor devices simultaneously, converting a sequential process into a parallel operation that dramatically reduces dicing time while maintaining precision.
Solution Approach 2:
Multiple dicing operations that would normally be performed sequentially along individual lines are merged into a single simultaneous operation. The through-holes enable the dicing blade to cut through multiple devices at once, combining multiple separation tasks into one efficient step.
3Length of moving object
If the semiconductor substrate thickness is reduced to increase packaging density, then device size decreases, but substrate strength decreases causing warping and fracturing
Solution Approach 1:
The supporter acts as a counterweight or reinforcing structure that compensates for the reduced strength of the thinned semiconductor substrate. By bonding the supporter to the substrate, the combination provides sufficient mechanical strength to prevent warping and fracturing during handling and manufacturing, enabling the use of thinner substrates for reduced device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the moisture resistance and reliability of semiconductor devices, reduces the dicing time significantly, and enables the production of thinner devices by allowing for the simultaneous separation of multiple semiconductor devices without the need for extensive dicing, thereby enhancing productivity.
Implementation Method 1
a supporter 105 made of a glass substrate or the like is bonded to the surface of the semiconductor substrate 100 through an adhesive layer 106 made of epoxy resin or the like
Data Source
AI summary
A semiconductor device with improved moisture resistance and its manufacturing method as well as a manufacturing method of a semiconductor device which simplifies a manufacturing process and improves productivity are offered. This invention offers a CSP type semiconductor device and its manufacturing method that can prevent moisture and the like from infiltrating into it to attain high reliability by covering a side surface of a semiconductor chip with a thick protection layer. This invention also offers a highly productive manufacturing method of semiconductor devices by which a supporter bonded to semiconductor dice is etched from a back surface-side of the supporter so that the semiconductor devices can be separated without dicing.