Semiconductor Through Electrode Fabrication via Mold Layer Support
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Solution Overview
Problem
The existing methods for creating semiconductor packages with through electrodes are inefficient, leading to decreased productivity and increased costs due to the need for carrier processes during wafer grinding.
Innovation Solution
A method involving the use of a polymer-based mold layer that provides rigidity to the substrate, allowing for mechanical thinning without adhesives, and the formation of through electrodes and pads, which enables the fabrication of semiconductor packages without the need for carrier attachment during grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If carrier process is used for wafer grinding to achieve through electrodes, then manufacturing precision is improved, but productivity decreases and cost increases
Solution Approach 1:
The invention extracts and eliminates the carrier process from the wafer grinding sequence. By forming the mold layer before thinning the substrate, the wafer can be directly held by the mold layer itself during grinding, removing the need for separate carrier attachment and detachment steps while maintaining grinding precision.
Solution Approach 2:
The mold layer is formed in advance on the wafer before the thinning process. This preliminary formation of the mold layer provides the necessary structural support and flatness during subsequent grinding operations, eliminating the need for carrier processes while ensuring manufacturing precision.
2Manufacturing precision
If carrier process is used for wafer grinding to achieve through electrodes, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The invention removes the carrier process from the manufacturing sequence, eliminating the costs associated with carrier materials, attachment adhesives, and additional processing steps. The mold layer serves dual purposes as both encapsulation and grinding support, reducing overall manufacturing costs while maintaining precision.
Solution Approach 2:
The mold layer performs multiple functions: it encapsulates the active layer, provides structural support during thinning, and serves as the holding medium during grinding operations. This multi-functionality eliminates the need for separate carrier components and processes, reducing manufacturing complexity and cost.
3Productivity
If substrate is thinned without carrier support, then productivity increases, but substrate warpage and damage occur
Solution Approach 1:
The mold layer is formed on the substrate before the thinning process begins. This preliminary formation provides the necessary structural reinforcement and support during subsequent grinding and thinning operations, preventing warpage and damage while enabling direct processing without carriers.
Solution Approach 2:
The combination of the substrate and the mold layer creates a composite structure where the mold layer (made of polymer material) provides complementary mechanical properties to the substrate. This composite structure enhances overall strength and rigidity during processing, preventing warpage and damage while maintaining substrate integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by eliminating the need for carrier attachment and reduces costs by preventing warpage and damage to the wafer, while maintaining the integrity of the semiconductor package structure.
Implementation Method 1
the device may be a vacuum chuck which directly holds and is in direct contact with the first mold layer
Data Source
AI summary
Semiconductor packages having through electrodes and methods for fabricating the same are provided. The method may comprise providing a first substrate including a first circuit layer, forming a front mold layer on a front surface of the first substrate, grinding a back surface of the first substrate, forming a first through electrode that penetrates the first substrate to be electrically connected to the first circuit layer, providing a second substrate on the back surface of the first substrate, the second substrate including a second circuit layer that is electrically connected to the first through electrode, forming a back mold layer on the back surface of the first substrate, the back mold layer encapsulating the second substrate, and removing the front mold layer.