Semiconductor Component Molded Body Reinforcement
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Solution Overview
Problem
Current methods for producing semiconductor components lack a simplified and cost-effective approach to achieving high mechanical stability, often requiring complex processing steps and materials that are not easily scalable or cost-effective.
Innovation Solution
A method involving a composite structure with a semiconductor layer stack, connection layers, and a metal layer, where a molded body material is applied to cover and reinforce the connection layers, and through contacts are formed by filling cutouts with conductive material, eliminating the need for thick dry resist layers and allowing for mechanical reinforcement and electrical connectivity without additional encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a composite structure with connection layers and molded body material is used, then mechanical stability is improved, but device complexity increases
Solution Approach 1:
The patent combines the connection layers, molded body material, and semiconductor layer stack into a single integrated composite structure. The molded body material is applied directly over the connection layers to form a unified component that provides both electrical connectivity and mechanical reinforcement simultaneously, eliminating the need for separate encapsulation steps.
Solution Approach 2:
The patent employs a composite structure consisting of multiple materials with different properties: conductive materials for connection layers, insulating molded body material for mechanical support, and semiconductor materials for active functions. This multi-material composite approach enables simultaneous achievement of electrical conductivity, mechanical strength, and electrical insulation within a single integrated structure.
2Manufacturing precision
If thick dry resist layers are used for processing, then manufacturing precision is improved, but loss of substance increases
Solution Approach 1:
The patent eliminates the thick dry resist layer from the processing sequence by applying molded body material directly over the connection layers. This removes the unnecessary intermediate step of applying and removing thick resist layers, thereby preventing material waste while maintaining precise patterning through the direct molding process.
3Reliability
If additional encapsulation steps are performed, then reliability is improved, but productivity decreases
Solution Approach 1:
The patent merges the encapsulation function with the connection layer formation process by applying molded body material directly over the connection layers during the same processing step. This integration eliminates separate encapsulation steps, maintaining product reliability through proper encapsulation while significantly improving production efficiency.
Solution Approach 2:
The molded body material is applied in advance over the connection layers before final component assembly, providing preliminary protection and mechanical support. This preliminary encapsulation action ensures reliability is established early in the manufacturing process, allowing subsequent steps to proceed more efficiently without requiring additional protective measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a mechanically stable and cost-effective component with simplified processing, reduced risk of contamination, and the ability to handle large areas, while maintaining electrical connectivity and thermal efficiency.
Implementation Method 1
The connection layers can be applied on the semiconductor layer stack by a coating method, for instance by an electrolytic or electroless coating method
Implementation Method 2
The connection layers can be applied on the semiconductor layer stack by a coating method, for instance by an electrolytic or electroless coating method
Implementation Method 3
the first metal layer is electrically connected to one of the group including the first and second connection layers and is electrically insulated from the other connection layer from said group
Implementation Method 4
a molded body material is applied on the composite for forming a molded body, such that in a plan view of the semiconductor layer stack the molded body covers the first connection layer and the second connection layer
Implementation Method 5
The first metal layer can laterally bridge an intermediate region arranged between the connection layers, preferably bridge a large portion of for instance at least 60%, at least 70% or at least 90% of the intermediate region and thereby mechanically reinforce the component to be produced at locations of the intermediate region
Implementation Method 6
through contacts are formed by filling cutouts with conductive material, eliminating the need for thick dry resist layers and allowing for mechanical reinforcement and electrical connectivity without additional encapsulation
Data Source
AI summary
A method for producing a component may include providing a composite including a semiconductor layer stack, a first connection layer and a second connection layer, wherein the first and second connection layers are arranged on the semiconductor layer stack, are assigned to different electrical polarities and are configured for the electrical contacting of the component to be produced, applying a molded body material on the composite for forming a molded body, such that in a plan view of the semiconductor layer stack the molded body covers the first connection layer and the second connection layer, forming a first cutout and a second cutout through the molded body for exposing the connection layers in places, and filling the first and second cutouts with an electrically conductive material for forming through contacts which are electrically conductively connected to the connection layers and extend through the molded body in the vertical direction.