Semiconductor Molding Composition for ELK Film Delamination Resistance
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Solution Overview
Problem
Integrated fan-out packages face issues with extreme low dielectric constant (ELK) film delamination due to moisture absorption, leading to potential DRAM retention failure, which existing technologies have not adequately addressed.
Innovation Solution
A molding composition incorporating a stress relaxation agent, such as silicone oil, is used to form an insulating encapsulant with reduced swelling properties, preventing hydrogen bonding and water cluster formation, and ensuring the ELK films are protected from moisture absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional molding composition is used to form insulating encapsulant, then manufacturing process is simple, but ELK films absorb moisture and delaminate causing DRAM retention failure
Solution Approach 1:
The patent modifies the chemical composition parameters of the molding material by incorporating specific compounds (silane-modified polymer, oxide particles) to change the physical and chemical properties of the encapsulant, thereby preventing moisture absorption and ELK film delamination while maintaining manufacturing simplicity
Solution Approach 2:
The patent creates a composite molding material by combining silane-modified polymer with oxide particles (silicon oxide, alumina, or titanium oxide) in specific ratios. This composite structure provides both moisture barrier properties and mechanical strength, preventing ELK film delamination without complicating the manufacturing process
2Reliability
If molding material with high swelling resistance is used, then ELK film delamination is prevented, but manufacturing precision and process control become more difficult
Solution Approach 1:
The patent optimizes the molecular weight and crosslinking density parameters of the silane-modified polymer to achieve appropriate swelling resistance. By controlling these parameters within specific ranges, the material provides sufficient delamination prevention while maintaining ease of molding and process control
Solution Approach 2:
The patent distributes oxide particles with specific size ranges (0.1-10 micrometers) uniformly throughout the molding material matrix. This local distribution of particulate reinforcement provides swelling resistance at the micro level while maintaining overall material processability and molding precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the stress relaxation agent in the molding composition significantly reduces swelling and delamination issues in ELK films, enhancing the reliability of semiconductor packages under thermal and humidity conditions.
Implementation Method 1
reduce hydrogen bonding formation
Implementation Method 2
preventing moisture absorption
Implementation Method 3
significantly reduces swelling
Data Source
AI summary
A molding composition for a semiconductor package includes fillers, a resin, a hardener and a stress relaxation agent. The fillers are contained in an amount of 80% by weight to 90% by weight based on a total weight of the molding composition. The resin is contained in an amount of 1% by weight to 15% by weight based on a total weight of the molding composition. The hardener is contained in an amount of 1% by weight to 15% by weight based on a total weight of the molding composition. The stress relaxation agent is composed of silicone oil, and is contained in an amount of 0.5% by weight to 5% by weight based on a total weight of the molding composition.