Semiconductor Molding Structure With Dynamic Flow Control Against Voids
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Solution Overview
Problem
The formation of voids between semiconductor chips and substrates during the encapsulation process due to uneven molding material flow, leading to reduced durability and reliability of semiconductor packages under thermal stress.
Innovation Solution
A molding apparatus with a dynamic part that moves relative to the mold part to control the flow of molding material, ensuring it fills the gap between the semiconductor device and substrate without voids, using a lower mold to carry the semiconductor device and an upper mold with a dynamic part to manage the flow direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molding material is injected to encapsulate the chip and fill into the gap between substrate and chip, then the gap is filled with molding material, but voids are formed in the gap due to uneven flow velocity
Solution Approach 1:
The patent introduces a dynamic part that can move relative to the mold part during the molding process. This dynamic component adjusts the flow path and flow velocity of the molding material in real-time, ensuring uniform filling of the gap between substrate and chip while preventing void formation. The dynamic adjustment capability allows the system to adapt to different filling stages and maintain optimal flow characteristics throughout the encapsulation process.
2Productivity
If molding material flows faster in regions without bump electrodes, then filling efficiency is improved, but voids occur in regions with bump electrodes due to roundabout flow
Solution Approach 1:
The dynamic part acts as an intermediary element between the mold part and the molding material flow. It mediates the flow velocity differences by physically blocking or redirecting the flow in specific regions, ensuring that molding material flows uniformly across both regions with and without bump electrodes. This intermediary component prevents the roundabout flow pattern that causes voids while maintaining overall filling efficiency.
3Ease of manufacture
If conventional molding process is used, then manufacturing simplicity is maintained, but voids reduce durability and reliability of semiconductor packages
Solution Approach 1:
The patent incorporates a dynamic part that moves relative to the mold part during molding, enabling control over molding material flow without significantly complicating the overall manufacturing process. This dynamic mechanism is integrated into the existing molding apparatus, allowing manufacturers to achieve void-free encapsulation and improved package reliability while maintaining relatively simple manufacturing procedures. The dynamic adjustment is automated and controlled, minimizing the need for complex manual interventions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves mechanical strength and prevents delamination by eliminating voids, enhancing the reliability of semiconductor packages.
Implementation Method 1
When the molding material is injected to encapsulate the chip and fill into a gap between substrate and the chip
Implementation Method 2
After filling the gaps between the substrate and the chip with the molding material, a treatment for thermally setting the molding material is performed, and stress is caused in the package by thermal expansion and thermal contraction
Data Source
AI summary
A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.