Semiconductor Module Molding Pressure Control
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Solution Overview
Problem
Existing semiconductor module manufacturing techniques face challenges in preventing encapsulating material from covering heat-dissipating surfaces, which are crucial for heat release, especially when the pressure in the molding cavity increases during resin filling.
Innovation Solution
A method and apparatus that utilize a pressing device to maintain constant pressure on the submodule, with a pressure measuring device and controller to control the piston feeding encapsulating material, ensuring the heat-dissipating surfaces remain exposed by reducing piston velocity before cavity filling is complete and using weirs to restrain material flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the cavity is filled with resin at high pressure, then the encapsulating material flows completely into the cavity, but the metal mold opens and the heat-dissipating surfaces are covered with resin
Solution Approach 1:
The pressing device applies preliminary pressing force to the submodule before resin filling begins, creating a counteracting force that prevents the metal mold from opening when resin pressure increases. This preliminary anti-action ensures the heat-dissipating surfaces remain exposed while allowing complete resin filling
Solution Approach 2:
The pressing device is activated before resin injection to establish constant pressure on the submodule, maintaining the metal mold closed state throughout the filling process. This preliminary action prevents the adverse effect of mold opening before the harmful effect occurs
2Manufacturing precision
If constant pressure is applied to the submodule during resin filling, then the heat-dissipating surfaces remain exposed, but the metal mold may open due to sharp pressure increase
Solution Approach 1:
The pressure sensor detects resin pressure in real-time and provides feedback to the control unit, which adjusts the pressing device force accordingly. This feedback mechanism maintains constant pressing force on the submodule while preventing metal mold opening, resolving the contradiction between surface exposure and mold stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents encapsulating material from covering heat-dissipating surfaces, ensuring efficient heat dissipation and preventing damage to semiconductor devices by maintaining controlled pressure and resin flow.
Implementation Method 1
a pressing device pressing one of the two heat-dissipating surfaces
Implementation Method 2
a pressure sensor for detecting pressure in the cavity
Implementation Method 3
when the cavity is filled with the resin
Data Source
AI summary
Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.