Semiconductor Package Molding with Granular Resin Insulation
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Solution Overview
Problem
Existing methods for manufacturing semiconductor devices face challenges in reducing the thickness of insulating layers for improved heat dissipation while maintaining insulation properties, leading to increased manufacturing costs and potential package strength degradation.
Innovation Solution
A method involving a granular first resin placed in contact with a die pad within a mold, followed by the injection and curing of a second resin on top, which prevents weld formation under the heat spreader and eliminates the need for structural modifications like notches, allowing for reduced package thickness and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the insulating layer is reduced to enhance heat dissipation, then heat dissipation capability is improved, but insulation property is degraded
Solution Approach 1:
The insulating layer is segmented into two distinct parts: a first insulating layer with greater thickness positioned at the periphery for insulation, and a second insulating layer with smaller thickness positioned immediately below the heat spreader for heat dissipation. This segmentation allows each region to be optimized for its specific function without compromise.
Solution Approach 2:
Different thickness specifications are applied to different locations of the insulating layer based on functional requirements. The peripheral region receives a thicker insulating layer for insulation, while the central region below the heat spreader receives a thinner layer for heat dissipation, achieving local optimization of both insulation and thermal management.
2Temperature
If the thickness of the insulating layer is reduced, then heat dissipation is improved, but moldability is degraded due to resin injection difficulties
Solution Approach 1:
The insulating layer is divided into two parts with different thicknesses, allowing the resin injection process to accommodate both thick and thin regions. The thicker peripheral portion provides adequate flow path for resin while the thinner central portion achieves the desired heat dissipation without causing injection defects.
3Temperature
If a high-performance resin with excellent thermal conductivity is used for the insulating layer, then heat dissipation property is improved, but manufacturing cost is increased
Solution Approach 1:
High-performance resin with excellent thermal conductivity is applied locally only in the second insulating layer immediately below the heat spreader where heat dissipation is critical. The first insulating layer at the periphery uses standard resin, significantly reducing material costs while maintaining heat dissipation performance where it matters most.
Solution Approach 2:
The insulating layer is segmented into two parts with different material specifications. The first insulating layer uses cost-effective standard resin for insulation purposes, while the second insulating layer uses high-performance resin for heat dissipation, optimizing both cost and performance.
4Ease of manufacture
If a dam such as a notch is provided in the front surface of the package to control resin flow, then resin injection control is improved, but package strength is degraded
Solution Approach 1:
The insulating layer with specified thickness is formed in advance before resin injection, creating a pre-defined flow barrier that controls resin distribution without requiring post-formed dams or notches. This preliminary structure ensures proper resin flow control while maintaining package integrity and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents insulation failures, reduces package strength degradation, and enables miniaturization while lowering manufacturing costs by avoiding the use of high-performance resins where not necessary, thus enhancing heat dissipation and insulation properties effectively.
Implementation Method 1
curing the first resin and the second resin, to mold the first resin and the second resin
Data Source
AI summary
It is an object to provide a method for manufacturing a semiconductor device which can reduce degradation in package strength and a manufacturing cost, and promote miniaturization of a package. A method for manufacturing a semiconductor device includes steps of (a) preparing a lead frame having a die pad on which a semiconductor element is mounted, (b) placing a first resin which is granular in a mold, (c) placing the lead frame in the mold in such a manner that the first resin comes into contact with a lower side of the die pad, (d) filling the mold with a second resin on an upper side of the first resin in the mold, and (e) curing the first resin and the second resin, to mold the first resin and the second resin.