Semiconductor Mount Groove Design for Solder Containment

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Solution Overview

Problem

The existing methods for bonding semiconductor elements to circuit patterns using solder result in solder adherence to electric wiring and semiconductor components, leading to increased processing and inspection costs due to the need for grooves around the entire perimeter, which complicates solidification and visual inspection.

Innovation Solution

A semiconductor device design featuring a groove in a specific region of the mount on the circuit pattern to guide and solidify solder, reducing adherence to other components and minimizing the need for extensive visual inspection, thereby lowering manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a groove is provided to surround the entire perimeter of the semiconductor element, then solder adherence to other components is suppressed, but processing costs of the circuit pattern increase

Engineering Contradiction:

Improvesolder adherence to other componentsVSAvoidprocessing costs of the circuit pattern

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The groove is segmented rather than continuous, being provided only at specific locations where solder is most likely to squirt out (such as corners or edges), rather than surrounding the entire perimeter. This segmentation reduces the total length of groove required, thereby lowering processing costs while still effectively containing solder at critical points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The groove is strategically positioned at specific local regions (such as corners or edges of the mount) where solder squirting is most likely to occur, rather than uniformly distributing grooves around the entire perimeter. This localized approach concentrates the containment function where it is most needed, reducing overall groove length and processing costs while maintaining effectiveness.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If a groove is provided around the entire perimeter of the semiconductor element, then solder containment is improved, but visual inspection time and costs increase

Engineering Contradiction:

Improvesolder squirting beyond containmentVSAvoidvisual inspection time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The groove is segmented and positioned at specific critical locations rather than forming a complete perimeter, which reduces the total inspection area required. Inspectors only need to examine the localized groove regions rather than the entire perimeter, significantly reducing visual inspection time and costs.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The groove is concentrated at specific local regions where solder containment is most critical, creating focused inspection points. This allows quality assurance to be performed efficiently by examining only these localized areas rather than conducting extensive perimeter inspections, reducing inspection time while maintaining quality standards.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If a groove is provided around the entire perimeter of the mount, then solder containment is improved, but manufacturing costs of the semiconductor device increase

Engineering Contradiction:

Improvesolder containmentVSAvoidmanufacturing costs of the semiconductor device

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The groove structure is segmented and positioned only at critical locations rather than forming a complete perimeter around the mount. This reduces the total amount of groove processing required, lowering manufacturing costs while still providing effective solder containment at the most critical points where solder squirting is most likely to occur.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The groove is strategically positioned at specific local regions (such as corners or edges) where solder containment is most needed, rather than uniformly distributing grooves around the entire mount perimeter. This localized approach minimizes the total groove length and processing requirements, reducing manufacturing costs while maintaining effective solder containment where it is most critical.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses solder adherence to other components and reduces manufacturing costs by focusing visual inspection on a localized groove area, improving processing efficiency and cost-effectiveness.

Implementation Method 1

the melted solder is cooled to be cured to thereby bond the semiconductor element to the circuit pattern

Methodology Applied

Scientific EffectSolidification: Freezing

Implementation Method 2

The solder squirting out from below the semiconductor element flows into the groove to suppress adherence of the solder to another member in the semiconductor device

Methodology Applied

Scientific EffectFluid flow:

Data Source

PatentUS20230154811A1Semiconductor device and method of manufacturing semiconductor device

Publication Date: 2023.05.18 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor device includes an insulating substrate and a semiconductor element. The insulating substrate includes an insulating layer and a front surface circuit pattern disposed on a surface of the insulating layer. The semiconductor element is bonded to a mount of a surface of the front surface circuit pattern via solder. A groove is provided in a region including a portion of the mount.