Semiconductor Mounting Device With Dual Substrates For Stress Mitigation
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Solution Overview
Problem
Existing semiconductor mounting devices face challenges in efficiently managing stress during semiconductor element mounting and maintaining productivity while meeting demands for multilayer wiring and enhanced power supply.
Innovation Solution
A semiconductor mounting device comprising a first substrate with insulation layers, conductor layers, and via conductors, and a second substrate with a core substrate, through-hole conductors, and buildup layers, where the second substrate is thicker than the first substrate, and bumps are formed on the first substrate for connection, allowing for effective stress mitigation and improved productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional multilayer wiring board is used, then multilayer wiring and enhanced power supply are achieved, but stress management during semiconductor element mounting becomes difficult and productivity decreases
Solution Approach 1:
The conventional multilayer wiring board is divided into two separate substrates: a first substrate containing first conductor layers and via conductors, and a second substrate containing a core substrate with through-hole conductors and buildup layers. These substrates are connected through bumps to form the final mounting device. This segmentation allows each substrate to be optimized independently for stress management while maintaining manufacturing productivity.
2Adaptability or versatility
If the number of layers is increased to meet multilayer wiring demands, then wiring capacity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of increasing the number of layers within a single substrate, the invention transitions to a three-dimensional stacked configuration with two separate substrates connected vertically through bumps. The first substrate and second substrate are positioned at different heights and connected via bumps, effectively utilizing the vertical dimension to achieve multilayer wiring functionality without proportionally increasing device complexity.
Data Source
AI summary
A semiconductor mounting device including a first substrate having insulation layers, conductor layers formed on the insulation layers, and via conductors connecting the conductor layers, a second substrate having insulation layers and conductor layers formed on the insulation layers of the second substrate, first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer of the first substrate formed on an outermost insulation layer of the first substrate, and second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost conductor layer of the second substrate formed on an outermost insulation layer of the second substrate. The second substrate has a thickness which is greater than a thickness of the first substrate.