Semiconductor Mounting Jig Vertical Alignment

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Solution Overview

Problem

The challenge in manufacturing semiconductor devices is achieving high positioning accuracy for tubular contact elements on insulated circuit boards, as poor accuracy can lead to inclined mounting, reducing the joining strength of soldered joints due to lack of solder within the tubular contact elements.

Innovation Solution

A mounting jig comprising an insulated circuit board positioning jig, a tubular contact element positioning jig with predetermined holes, and a tubular contact element press-down jig is used to accurately position and solder tubular contact elements onto the circuit board, ensuring vertical alignment and secure soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional mounting methods are used without positioning jigs, then the manufacturing process is simple, but the positioning accuracy of tubular contact elements deteriorates

Engineering Contradiction:

Improvepositioning accuracyVSAvoidmounting process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

A positioning jig is introduced as an intermediary tool between the mounting device and the tubular contact elements. The positioning jig includes positioning holes that guide the tubular contact elements into correct positions on the insulated circuit board, ensuring accurate alignment without requiring complex direct control mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The positioning jig enables the tubular contact elements to self-position through the positioning holes. The elements automatically align themselves with the holes during insertion, achieving self-positioning without requiring additional active control systems or complex positioning mechanisms.

Inventive Principle:

Principle #25Self-service

2Strength

If tubular contact elements are mounted without proper positioning, then the mounting process is faster, but the joining strength of soldered joints deteriorates

Engineering Contradiction:

Improvejoining strengthVSAvoidmounting time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The positioning holes in the positioning jig are pre-configured at the correct positions and orientations. This preliminary preparation ensures that when tubular contact elements are inserted, they are automatically positioned correctly for optimal soldering, eliminating the need for time-consuming post-positioning adjustments and ensuring strong joints from the start.

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If tubular contact elements are mounted at inclined angles, then the mounting process is easier, but the solder filling inside the tubes deteriorates

Engineering Contradiction:

Improvemounting easeVSAvoidvertical alignment accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The positioning holes are designed to counteract the tendency of tubular contact elements to mount at inclined angles. By providing precise geometric constraints through the positioning holes, the design prevents inclined mounting before it can occur, ensuring vertical alignment without requiring additional active correction mechanisms.

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables tubular contact elements to be mounted with high positional accuracy, ensuring reliable soldering and improved joining strength by ensuring the tubular contact elements are vertically aligned and securely pressed onto the circuit board during the soldering process.

Implementation Method 1

a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert the tubular contact elements

Methodology Applied

Scientific EffectPhysical Containment: Physical Containment

Implementation Method 3

the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS10405434B2Mounting jig for semiconductor device

Publication Date: 2019.09.03 FUJI ELECTRIC CO LTD

AI summary

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.