Semiconductor Mounting Stage with Anisotropic Thermal Resistance
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Solution Overview
Problem
Conventional semiconductor chip bonding methods face challenges in accurately heating the target chip while minimizing heat input to adjacent chips, leading to potential deterioration and decreased mounting quality, especially when heating the entire stage.
Innovation Solution
A mounting apparatus with a stage having a multilayer structure and an irradiation unit that uses electromagnetic waves to locally heat the substrate or intermediate member, allowing for precise heating of the bonding target while reducing heat transfer to other chips, combined with a mounting head for compress-bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the entire stage is heated to heat the lowermost semiconductor chip, then the target chip can be appropriately heated, but adjacent chips are also continuously heated causing deterioration of resin and decreased mounting quality
Solution Approach 1:
The patent applies local quality by making different regions of the stage have different thermal properties. Specifically, the stage has a first region with higher thermal conductivity and a second region with lower thermal conductivity. The first region is positioned under the target semiconductor chip to facilitate heat delivery, while the second region is positioned under adjacent chips to suppress heat transfer and prevent thermal deterioration. This spatial variation in thermal conductivity allows selective heating of the target chip while protecting adjacent chips from excessive heat.
Solution Approach 2:
The stage is segmented into multiple functional regions with different thermal conductivities. The heating function is divided between a first region designed for heat delivery and a second region designed for heat isolation. This segmentation allows the system to simultaneously achieve effective heating of the target chip while preventing harmful heat transfer to adjacent chips, resolving the contradiction between heating effectiveness and thermal protection.
2Object-affected harmful factors
If a heater is embedded in the stage for local heating, then heat input to non-target chips is reduced, but it becomes difficult to maintain flatness of the stage
Solution Approach 1:
Instead of embedding heaters that could disrupt stage flatness, the patent uses local quality by creating regions with different thermal conductivities through material selection or structural design. The first region has higher thermal conductivity for heat delivery, while the second region has lower thermal conductivity for heat isolation. This approach achieves local heating control without compromising the overall flatness of the stage, as no physical heaters are embedded in the stage structure.
Solution Approach 2:
The patent replaces the mechanical approach of embedding heaters in the stage with a thermal design approach using regions of different thermal conductivity. This substitution avoids the mechanical complexity and flatness issues associated with embedded heaters while achieving the same goal of localized heating control through intelligent thermal management.
3Temperature
If the entire stage is heated, then heating can be performed from both upper and lower sides of the chip, but heat is input to the chip for a long time causing deterioration of resin on the bottom surface
Solution Approach 1:
The patent uses local quality to create a thermal gradient across the stage, with the first region providing efficient heat delivery to minimize heating duration. By concentrating thermal energy in the first region under the target chip, the system achieves effective heating from the lower side without requiring prolonged heating of the entire stage, thus reducing thermal exposure time and preventing resin deterioration.
Solution Approach 2:
The patent implements rapid heating by concentrating thermal energy in the first region with higher thermal conductivity. This allows the target chip to be heated quickly from both upper and lower sides in a short time period, skipping the prolonged heating duration that would cause resin deterioration. The second region with lower thermal conductivity simultaneously prevents heat from spreading to adjacent chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables appropriate heating of the target semiconductor chip while suppressing heat input to adjacent chips, improving mounting quality and reducing thermal deterioration, thus enhancing the bonding process.
Implementation Method 1
an irradiation unit that irradiates, from the second surface side, an electromagnetic wave transmitting through the stage and heating the substrate or the intermediate member
Implementation Method 2
the first layer has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction
Data Source
AI summary
A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip (12) to a mounted object that is a substrate (30) or another semiconductor chip (12) is provided. The mounting apparatus includes: a stage (120) on which the substrate (30) is placed, a mounting head (124) that is capable of moving relative to the stage (120) and bonds the semiconductor chip (12) to the mounted object, and an irradiation unit (108 that irradiates, from a lower side of the stage (120), an electromagnetic wave transmitting through the stage and heating the substrate (30). The stage (120) has a first layer (122) formed on an upper surface side, and the first layer (122) has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.