Semiconductor Mounting Structure Heat Radiation and Warping Control
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Solution Overview
Problem
Existing semiconductor mounting structures face issues with warping and solder cracks due to heat-generated semiconductor components, particularly when using boards with different material properties and expansion coefficients, leading to localized stress and failure.
Innovation Solution
A semiconductor mounting structure is designed with a first semiconductor component sealed in resin, mounted on a system-on-chip board, which is then mounted on a main board with an opening for heat radiation, using thermal conductive members and strategically placed solder patterns to manage heat and reduce stress, eliminating the need for an intermediate board and thus minimizing warping and solder cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heat-generated semiconductor components are mounted on boards with different material properties and expansion coefficients, then the mounting structure can accommodate various semiconductor components, but warping and solder cracks occur due to localized stress
Solution Approach 1:
The patent introduces an intermediate board that segments the mounting structure into distinct layers. The first board mounts the first semiconductor component, the intermediate board provides a transition layer with appropriate material properties, and the second board provides the opening portion for heat radiation. This segmentation allows each layer to be optimized for its specific function while reducing overall stress and warping.
Solution Approach 2:
The intermediate board acts as a mediator between the first board and the second board. It has material properties that bridge the gap between the two boards with different expansion coefficients, reducing thermal stress and preventing solder cracks while still allowing heat to be conducted to the second board's opening portion.
2Reliability
If an intermediate board is introduced to manage heat and reduce stress, then warping and solder cracks are suppressed, but the device complexity increases
Solution Approach 1:
The intermediate board performs multiple functions simultaneously: it provides mechanical support, manages thermal expansion differences between boards, conducts heat from the first semiconductor component, and enables the opening portion on the second board to radiate heat effectively. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The opening portion is strategically positioned on the second board at a location that faces the first semiconductor component, creating a localized heat radiation path. This localized approach allows heat to be efficiently radiated from the critical heat-generating area without requiring the entire board structure to be modified.
3Temperature
If the opening portion is made larger to improve heat radiation, then heat dissipation efficiency increases, but the structural integrity and strength of the second board decrease
Solution Approach 1:
The opening portion is sized to provide sufficient heat radiation capability for the first semiconductor component without unnecessarily removing excessive board material. The opening is larger than the minimum required to face the component, ensuring adequate heat radiation, but is controlled in size to maintain the second board's structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively suppresses warping and solder cracks by efficient heat radiation and stress management, protecting the semiconductor components and extending their lifespan.
Implementation Method 1
a thermal conductive member connected to the second semiconductor component
Implementation Method 2
the second board has an opening portion at least at a position facing the second semiconductor component of the first board
Data Source
AI summary
Provided is a semiconductor mounting structure capable of suppressing cracks generated in solder and effectively radiating heat of a heat-generated semiconductor. A DRAM package, a SoC board on which the DRAM package is mounted, and a main board on which the SoC board is mounted are provided. A silicon chip is mounted on a surface of the SoC board facing the main board, and the main board has an opening portion at least at a position facing the silicon chip of the SoC board.