Semiconductor Mounting Structure With Wettability-Controlled Bonding
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Solution Overview
Problem
Optical semiconductor elements generate heat during light emission, leading to bonding material creeping up and potential short circuits due to heat generation, which deteriorates the quality of semiconductor components.
Innovation Solution
A mounting structure with a carrier and conductor layer having distinct wettability properties, featuring a first region and spaced second regions to control bonding material spread, preventing creeping up and maintaining visibility of mounting markers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical semiconductor element is mounted on the carrier via bonding material, then the semiconductor component can be assembled, but the bonding material creeps up to the side surface of the optical semiconductor element due to heat generation, causing short circuits and deteriorating quality
Solution Approach 1:
The patent introduces a conductor layer as an intermediary between the carrier and the optical semiconductor element. This conductor layer has higher wettability with respect to the bonding material than the carrier, causing the bonding material to preferentially wet the conductor layer and remain confined to the mounting surface, thereby preventing it from creeping up the side surfaces of the semiconductor element.
Solution Approach 2:
The conductor layer is designed with a specific geometric configuration including a first region with at least four sides and two or more second regions spaced apart along a first side. This local structural differentiation creates zones with different wettability characteristics, guiding the bonding material to spread only in designated areas and preventing unwanted flow toward the semiconductor element's side surfaces.
2Strength
If the bonding material is applied on the carrier, then the optical semiconductor element can be bonded, but heat generation from the optical semiconductor element causes the bonding material to creep up
Solution Approach 1:
The conductor layer serves as a thermal and bonding interface intermediary. It provides a dedicated pathway for heat dissipation while simultaneously controlling the bonding material's wetting behavior, allowing strong bonding to be maintained without the bonding material creeping up due to thermal effects.
Solution Approach 2:
The patent changes the wettability parameter of the surface by introducing the conductor layer with higher wettability. This parameter change ensures that even under thermal stress, the bonding material remains confined to areas with high wettability (the conductor layer) rather than spreading to areas with lower wettability (the carrier and semiconductor element sides).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bonding material from creeping up to the semiconductor element, reducing the risk of short circuits and ensuring the integrity of the semiconductor component.
Implementation Method 1
a carrier (11) including a first surface (11a) having a first wettability with respect to a bonding material (20), and a conductor layer (12) that is provided on the first surface (11a) and has a second wettability higher than the first wettability with respect to the bonding material (20)
Data Source
AI summary
Provided is a mounting structure and a semiconductor component that have a structure capable of suppressing creeping up of a bonding material. The mounting structure according to the present disclosure includes a carrier including a first surface having a first wettability with respect to a bonding material, and a conductor layer being provided on the first surface and having a second wettability higher than the first wettability with respect to the bonding material. The conductor layer includes a first region having at least four sides, and two or more second regions spaced apart from each other along a first side of the at least four sides.