Semiconductor Device Multi-Layer Structure Insulation Reliability
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with multi-layer terminal structures face challenges due to the deterioration of insulating sheets when exposed to high temperatures during the molding process, leading to inadequate insulation between terminals and reduced reliability of the semiconductor device.
Innovation Solution
A semiconductor device design featuring a case with concave portions and beam members that house a multi-layer structure of terminals and insulating sheets, where the multi-layer structure is assembled separately and fixed using adhesives, preventing direct contact with the high-temperature case resin and allowing the use of insulating materials with lower withstand temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the multi-layer structure is formed by insertion molding with case resin material, then the manufacturing process is simplified and productivity is improved, but the insulating sheet deteriorates due to contact with high-temperature case resin material during molding
Solution Approach 1:
The patent divides the manufacturing process into separate stages: the multi-layer structure (terminals and insulating sheet) is formed independently first, then assembled into the case as a complete unit. This segmentation prevents the insulating sheet from being exposed to high-temperature case resin during molding, thereby maintaining insulation reliability while still achieving efficient assembly through the integrated multi-layer structure.
Solution Approach 2:
The multi-layer structure is prepared in advance through preliminary assembly of terminals and insulating sheet before the case molding process. This preliminary action ensures that the insulating sheet is protected from high-temperature degradation, as it is already in place and protected by the terminal structure before any high-temperature processes occur.
2Adaptability or versatility
If an insulating material with low withstand temperature is used for the insulating sheet, then manufacturing flexibility and material selection are improved, but the insulating sheet deteriorates during high-temperature molding process
Solution Approach 1:
The patent extracts the insulating sheet from the high-temperature molding environment by forming the multi-layer structure separately and assembling it as a complete unit into the case. This allows the use of insulating materials with lower withstand temperatures, as they are never exposed to high-temperature case resin during the molding process, thereby maintaining both material flexibility and insulation performance.
3Reliability
If the multi-layer structure is assembled separately and fixed using adhesives, then the insulating sheet integrity is maintained and material selection is expanded, but the device complexity increases
Solution Approach 1:
The patent merges the terminals and insulating sheet into a single integrated multi-layer structure that is assembled and fixed together using adhesives. This merging approach maintains the integrity of the insulating sheet by preventing direct contact with high-temperature case resin, while the adhesive bonding simplifies the overall assembly process compared to traditional molding methods, thereby reducing rather than increasing device complexity.
Data Source
AI summary
A semiconductor module (semiconductor device) includes a case that has a side wall to form a frame, the side wall having a concave portion, a multi-layer structure in which a first terminal, an insulating sheet, and a second terminal are stacked in that order and which is disposed on the concave portion, and a beam member that is attached to the concave portion of the case to fix the multi-layer structure disposed on the concave portion.