Semiconductor Integrated Circuit Multi-Layer Power Supply Routing
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Solution Overview
Problem
In semiconductor integrated circuits, the arrangement of power supply wires and via plugs occupies many routing tracks, reducing signal wire efficiency, while reducing their number leads to a larger drop in power supply voltage.
Innovation Solution
The implementation of a multi-layered power supply wire structure with strategically arranged power supply strap wires, auxiliary power supply strap wires, intermediate power supply wires, and power supply rails, where the intervals between these wires are optimized to minimize the use of routing tracks for power supply wires and maximize signal wire efficiency, while controlling voltage drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power supply wires and via plugs are arranged densely to maintain voltage stability, then voltage drop is reduced, but signal wire efficiency deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional multi-layered structure by introducing power supply wires in different routing layers (first, second, and third routing layers). This vertical stacking allows power supply wires to occupy different spatial dimensions, reducing their competition for the same routing tracks and improving signal wire efficiency while maintaining adequate power supply coverage.
Solution Approach 2:
The patent segments the power supply network into multiple independent routing layers, with each layer containing specific power supply wires. This segmentation allows the power supply function to be distributed across multiple layers rather than concentrated in a single layer, reducing the density of power supply wires in any one layer and freeing up routing tracks for signal wires.
2Productivity
If the number of power supply wires and via plugs is reduced to improve signal wire efficiency, then signal wire routing tracks increase, but voltage drop increases
Solution Approach 1:
By distributing power supply wires across multiple routing layers (first, second, and third layers), the patent utilizes the vertical dimension to maintain adequate power supply coverage without increasing the density of power supply wires in any single layer. This allows more routing tracks to be available for signal wires while maintaining voltage stability through the multi-layered power supply network.
3Reliability
If power supply wires occupy many routing tracks to control voltage drop, then voltage stability is improved, but available routing tracks for signal wires decrease
Solution Approach 1:
The patent resolves the conflict between voltage stability and routing track availability by moving the power supply network into the third dimension through multiple routing layers. Power supply wires in the first, second, and third routing layers utilize vertical space rather than horizontal routing tracks, thereby maintaining adequate power supply coverage for voltage stability while freeing up routing tracks in each individual layer for signal wire routing.
Solution Approach 2:
The patent segments the power supply function across multiple routing layers, with each layer containing a subset of power supply wires. This segmentation reduces the concentration of power supply wires in any single layer, thereby increasing the number of available routing tracks for signal wires in each layer while maintaining overall power supply coverage through the combined multi-layer structure.
Data Source
AI summary
In one embodiment, a semiconductor integrated circuit includes power supply strap wires extending in a first direction in a first layer, auxiliary power supply strap wires extending in the first direction in a second layer below the first layer, and intermediate power supply wires each electrically connecting one of the power supply strap wires to one of the auxiliary power supply strap wires in a third layer between the first and second layers. The circuit further includes power supply rails extending in a second direction in a fourth layer below the second layer, and upper power supply strap wires extending in the second direction in a fifth layer above the first layer. An interval between the intermediate power supply wires is larger than an interval between the power supply rails, and is smaller than an interval between the upper power supply strap wires.