Semiconductor Device Multilayer Wiring Planarity
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Solution Overview
Problem
Existing liquid discharge apparatuses face challenges in increasing the number of wiring layers while maintaining the planarity of the upper surface of the protective layer covering the heat generation element, limiting the degree of freedom for wiring layout.
Innovation Solution
A semiconductor device with a multilayer wiring structure, where a heat generation element and a metal member are separated and positioned equally above an insulating layer, and an electrically conductive member with lower resistivity than the metal member is used to enhance wiring layout flexibility, allowing for additional wiring layers and improved planarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all wiring layers are formed under a heat generation element, then the heat generation element can be properly connected, but it becomes difficult to increase the number of wiring layers while maintaining planarity of the protective layer
Solution Approach 1:
The patent transitions from a two-dimensional planar wiring layout to a three-dimensional stacked wiring architecture. Multiple wiring layers are arranged vertically above the heat generation element rather than all in the same plane, enabling increased wiring complexity while maintaining the planarity of the protective layer's upper surface.
Solution Approach 2:
The wiring structure is segmented into multiple independent layers (first wiring layer, second wiring layer, third wiring layer) separated by insulating films. This segmentation allows each wiring layer to be independently formed and connected to the heat generation element through separate contact holes, facilitating complex wiring arrangements without compromising protective layer planarity.
2Adaptability or versatility
If multiple wiring layers are added, then wiring functionality increases, but the degree of freedom for wiring layout is constrained
Solution Approach 1:
By utilizing the vertical dimension with multiple stacked wiring layers, the patent dramatically increases wiring layout flexibility. The heat generation element can be connected from different horizontal positions through contact holes in different layers, enabling versatile routing options that would be impossible in a single-plane configuration.
Solution Approach 2:
Insulating films serve as intermediaries between wiring layers, allowing independent routing designs for each layer. The first, second, and third wiring layers can be independently connected to the heat generation element through contact holes formed in the respective insulating films, providing extensive freedom in wiring layout configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables increased flexibility in wiring layout and the addition of multiple wiring layers without compromising the planarity of the protective layer, enhancing the performance of the liquid discharge apparatus.
Implementation Method 1
there is a method for discharging ink by causing ink to bubble by heating it with a heat generation element
Data Source
AI summary
A semiconductor device used for a liquid discharge head is provided. The device includes a wiring layer, an insulating member formed above the wiring layer, a heat generation element arranged above and in contact with the insulating member, and electrically connected to the wiring layer, a metal member arranged above and in contact with the insulating member, and electrically connected to the wiring layer, and an electrically conductive member covering an upper surface of the metal member and electrically connected to the wiring layer through the metal member. A resistivity of the electrically conductive member is less than a resistivity of the metal member and a resistivity of the heat generation element. The heat generation element and the metal member are separated from each other.