Semiconductor Device With Multiple Bonded Heat Sinks
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Solution Overview
Problem
Mounting elements of different types on a semiconductor substrate without considering their thermal properties can lower the reliability of the final device, particularly due to heat-related damage during the reflow process, which restricts the number of reflows and complicates the attachment of heat sinks.
Innovation Solution
A method involving the use of a metal material to attach a heat sink to a first element and a resin material to attach a second heat sink to a second element, allowing for separate thermal management and reducing the risk of heat-related damage during the reflow process, thereby enabling the reliable mounting of multiple types of elements on a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If elements of different types are mounted on the same substrate to increase density and reduce wiring length, then productivity and device performance are improved, but reliability deteriorates due to heat-related damage during reflow process
Solution Approach 1:
The patent segments the substrate into multiple regions with different reflow temperature characteristics. High-temperature resistant elements are mounted in regions that can withstand higher reflow temperatures, while temperature-sensitive elements are mounted in regions with lower reflow temperatures. This spatial segmentation allows all elements to be mounted on the same substrate without heat-related damage, resolving the contradiction between device density and element integrity.
2Manufacturing precision
If reflow temperature is increased to ensure proper soldering, then manufacturing precision is improved, but reliability worsens due to heat damage to temperature-sensitive elements
Solution Approach 1:
The patent implements local quality by creating regions with different thermal properties on the substrate. Each region is designed with specific heat dissipation characteristics tailored to the elements mounted in that region. This allows high reflow temperatures in regions requiring strong solder joints while maintaining low reflow temperatures in regions with temperature-sensitive elements, simultaneously achieving both soldering quality and element survival.
3Temperature
If heat sinks are attached to all elements to improve thermal management, then temperature control is improved, but device complexity increases due to different attachment requirements for different element types
Solution Approach 1:
The patent creates a universal substrate design with integrated thermal management regions that can accommodate different element types with different thermal requirements. The substrate itself provides the thermal management function through its region-specific thermal properties, eliminating the need for separate heat sink attachment processes for different element types. This universal approach simplifies the overall device complexity while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of semiconductor devices by allowing for effective thermal management of both high-power and low-power elements, maintaining the integrity of active elements and reducing the risk of reflow-related damage, while also simplifying the attachment process.
Implementation Method 1
heating and melting the metal material
Implementation Method 2
attaching the first heat sink to the first element via the metal material
Data Source
AI summary
A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.