Semiconductor Device Noise Reduction via Insulating Member
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Solution Overview
Problem
Existing semiconductor devices with arm series circuits face challenges in reducing conducted noise and radiation noise due to common mode currents, which are generated by floating capacitances between the arm series circuits and the ground, leading to increased noise transfer via the power supply or other apparatuses.
Innovation Solution
The semiconductor device incorporates an insulating substrate with a convex-shaped insulating member separating the output terminal from the ground, reducing the floating capacitance and increasing impedance, thereby minimizing common mode currents and associated noise. Additionally, switching elements' electrodes are connected directly to terminals without interconnection lines, facilitating efficient noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the output terminal is disposed close to the insulating substrate, then the device complexity is reduced, but the floating capacitance increases causing increased conducted noise and radiation noise
Solution Approach 1:
The output terminal is elevated from the plane of the insulating substrate by using an insulating member with a convex shape, creating a vertical separation. This dimensional change increases the distance between the output terminal and the insulating substrate, thereby reducing floating capacitance and the associated conducted and radiation noise without significantly increasing overall device complexity.
2Manufacturing precision
If interconnection lines are used to connect switching element electrodes to terminals, then the manufacturing precision is improved, but the device complexity and noise transfer increase
Solution Approach 1:
The patent removes the interconnection lines from the circuit structure by directly joining the switching element electrodes to the terminals on the insulating substrate. This extraction of unnecessary components simplifies the device structure, reduces potential noise transfer paths, and eliminates manufacturing complexities associated with interconnection line attachment while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces conducted and radiation noise by decreasing the common mode current flowing between the output terminal and ground, enhancing impedance and minimizing noise transfer, while allowing for easier connection of gate electrodes to control lines without additional interconnection lines.
Implementation Method 1
floating capacitances between the arm series circuits and the ground
Implementation Method 2
increasing impedance, thereby minimizing common mode currents
Data Source
AI summary
A semiconductor device includes at least one arm series circuit. The at least one arm series circuit includes an upper arm, a lower arm, an insulating substrate, a positive terminal, a negative terminal, an upper arm control terminal, a lower arm control terminal, and an insulating member. The lower arm is connected to the upper arm in series. Each of the upper arm and the lower arm includes a switching element and a diode connected in anti-parallel to the switching element. The insulating substrate is disposed on ground. The positive terminal is provided on the insulating substrate. The negative terminal is provided on the insulating substrate. The upper arm control terminal is provided on the insulating substrate. The lower arm control terminal is provided adjacent to the negative terminal on the insulating substrate.