Semiconductor Device Non-Adhesive Portion Thermal Stress
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Solution Overview
Problem
In semiconductor devices, thermal stress at the interface between the adhesive portion and the sealing resin body can lead to separation of the sealing resin body from the conductive member, particularly when the adhesive portion is adjacent to the solder, increasing the risk of resin body separation.
Innovation Solution
Incorporating a non-adhesive portion between the mounting portion and the adhesive portion, where the solder does not connect, and ensuring the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion, thereby reducing thermal stress and preventing separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive portion is adjacent to the solder, then the sealing resin body can be securely attached to the conductive member, but thermal stress causes separation of the sealing resin body from the conductive member
Solution Approach 1:
The peripheral portion of the conductive member is divided into two distinct regions: an adhesive portion for securing the sealing resin body and a non-adhesive portion that prevents thermal stress concentration. This segmentation allows the adhesive portion to maintain strong bonding while the non-adhesive portion acts as a stress relief zone, preventing separation at the interface between the adhesive portion and sealing resin body.
Solution Approach 2:
Different regions of the conductive member's peripheral portion are given different properties: the adhesive portion has high adhesion to the sealing resin body for secure attachment, while the non-adhesive portion has low adhesion to prevent stress concentration. This local differentiation of properties allows the structure to simultaneously achieve strong bonding where needed and stress relief where critical.
2Strength
If the adhesive portion is provided to surround the mounting portion, then the sealing resin body can be firmly secured, but thermal stress at the interface leads to separation
Solution Approach 1:
The non-adhesive portion acts as an intermediary zone between the mounting portion and the adhesive portion. It serves as a buffer that interrupts the continuous adhesive interface, thereby preventing the transmission and concentration of thermal stress from the mounting portion to the adhesive portion-sealing resin body interface, while still allowing the adhesive portion to firmly secure the sealing resin body.
Data Source
AI summary
The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.