Semiconductor Arrangement With Non-Protruding Contact Points
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for a semiconductor arrangement with excellent optical properties that occupies minimal space, while also being compact and efficient in design, with the ability to be surface-mounted without the need for through-plating, and capable of handling thermal and mechanical stresses.
Innovation Solution
The semiconductor arrangement features a radiation-transmissive body with a semiconductor chip attached via an adhesive connection that is transparent to radiation, with electrical connection points that do not protrude laterally, allowing for surface mounting and efficient manufacturing, and includes optional filtering and scattering agents for enhanced optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is mounted with contact points extending beyond the body, then electrical connection is improved, but the lateral space requirement increases
Solution Approach 1:
Instead of extending contact points beyond the body to achieve better electrical connection, the patent inverts the approach by having the body extend beyond the contact points. This reverses the traditional mounting geometry, allowing the semiconductor chip to be electrically connected within a smaller lateral footprint while the body provides the necessary structural and optical functions.
Solution Approach 2:
The patent transitions from a two-dimensional lateral extension of contact points to a three-dimensional configuration where the body extends in the vertical direction beyond the contact points. This dimensional change allows the electrical connection to be achieved within the lateral bounds of the contact points while the body provides additional functionality in the vertical dimension.
2Area of stationary object
If the contact points are constrained not to project laterally beyond the body, then the lateral space is reduced, but the electrical contact reliability may be compromised
Solution Approach 1:
The patent employs a composite structure where the body material extends beyond the contact points to provide both structural support and electrical connection functions. This composite arrangement allows the contact points to remain within the lateral bounds while the extended body material ensures reliable electrical contact through its conductive properties.
Solution Approach 2:
The body acts as an intermediary element that bridges the electrical connection between the semiconductor chip and the mounting surface. By extending the body beyond the contact points, it provides a larger contact area and improved electrical pathway without requiring the contact points themselves to extend laterally.
3Illumination intensity
If a radiation-transmissive body is used to improve optical properties, then light transmission is enhanced, but the device complexity increases
Solution Approach 1:
The radiation-transmissive body performs multiple functions simultaneously: it provides structural support for the semiconductor chip, serves as a mounting platform, and acts as an optical element for light transmission. This multi-functionality eliminates the need for separate housing and optical components, thereby reducing overall device complexity while maintaining enhanced optical properties.
Solution Approach 2:
The patent merges the housing, mounting structure, and optical transmission elements into a single radiation-transmissive body. This consolidation integrates multiple previously separate components into one element, simplifying the device structure while preserving all necessary functions including mechanical support and optical performance.
4Ease of manufacture
If the semiconductor arrangement is designed for surface mounting without through-plating, then manufacturing is simplified, but the mechanical strength of connection may be reduced
Solution Approach 1:
The contact points and body are pre-configured during manufacturing to provide inherent mechanical strength for surface mounting. The extended body structure and optimized contact point geometry are established in advance to ensure adequate mechanical connection strength without requiring through-plating, thereby simplifying the manufacturing process while maintaining connection integrity.
Solution Approach 2:
The patent optimizes parameters such as contact point dimensions, body geometry, and material properties to achieve the necessary mechanical connection strength for surface mounting applications. By adjusting these parameters, the design achieves sufficient mechanical strength without the complexity of through-plating, balancing manufacturing ease with connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the production of compact, high-density semiconductor components with improved optical properties, reduced manufacturing costs, and enhanced durability against thermal and mechanical stresses, while maintaining efficient radiation transmission and handling.
Implementation Method 1
The adhesive connection is designed to be transparent to radiation emitted or incident on the semiconductor chip
Implementation Method 2
The body is transparent or transmissive to at least part of the radiation to be received or emitted by the semiconductor chip
Implementation Method 3
The radiation-transmissive body or adhesive connection includes scattering means which have a scattering effect on the radiation emitted or to be received by the semiconductor chip
Implementation Method 4
The radiation-transmissive body or adhesive connection includes conversion means which convert at least part of the radiation emitted or to be received by the semiconductor chip into radiation of a different frequency
Implementation Method 5
The adhesive connection includes a filter means which absorbs part of the radiation emitted or to be received by the semiconductor chip
Data Source
Figure 1~3
Figure 4~6
Figure 7~8
AI summary
According to at least one embodiment of the semiconductor arrangement, it comprises a mounting side, at least one optoelectronic semiconductor chip having mutually opposing chip tops and chip bottoms, and at least one at least partially radiation-permeable body having a body bottom on which the semiconductor chip is attached such that the chip top faces the body bottom. The semiconductor arrangement further comprises at least two electrical connecting points for the electrical contacting of the optoelectronic semiconductor chip, wherein the connecting points do not laterally project beyond the body and with the sides thereof facing away from the semiconductor chip delimit the semiconductor arrangement at the mounting side thereof.