Semiconductor Device Nonvolatile Memory Threshold Voltage Uniformity

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Solution Overview

Problem

Existing semiconductor devices face challenges in reducing variations in threshold voltage between nonvolatile memory cells, leading to inconsistent performance and reliability issues.

Innovation Solution

The semiconductor device incorporates a semiconductor substrate with specifically designed element separating portions and a dummy region to electrically isolate memory cells, ensuring that the first portion of the element separating portion is equivalent in width to the second element separating portion, which helps in reducing threshold voltage variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional element separating portions are used without dummy regions, then device complexity is reduced, but threshold voltage variation between memory cells increases

Engineering Contradiction:
Improvethreshold voltage uniformityVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The element separating portion is divided into a first portion (in the channel extension region) and a second portion (in the active region), with different width specifications. The first portion has a width equivalent to the second element separating portion width, while the second portion has a different width. This segmentation allows different regions to serve different functions: the first portion controls threshold voltage uniformity while the second portion provides electrical isolation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A dummy region is introduced as an intermediary structure between the first region (memory cell region) and the second region (peripheral circuit region). This dummy region acts as a buffer that prevents direct electrical interaction between the memory cells and peripheral circuits, thereby stabilizing the threshold voltage of memory cells by isolating them from voltage fluctuations in the peripheral circuits.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If element separating portions with equivalent width are used, then threshold voltage variation is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvememory cell performance consistencyVSAvoidwidth control precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

Different regions of the element separating portion are assigned different width specifications based on their functional requirements. The first portion (in the channel extension region) has a width equivalent to the second element separating portion width to ensure threshold voltage uniformity, while the second portion (in the active region) has a different width optimized for electrical isolation. This local differentiation allows each region to perform its specific function optimally.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The dummy region is designed to create an equipotential zone between the memory cell region and peripheral circuit region. By providing a sufficiently wide dummy region, voltage fluctuations from the peripheral circuits are isolated, creating a stable potential environment for the memory cells. This equipotential design reduces threshold voltage variation without requiring extremely precise width control throughout the entire structure.

Inventive Principle:
Principle #12Equipotentiality

Data Source

PatentUS11075211B2Semiconductor device with nonvolatile memory
Publication Date: 2021.07.27 ROHM CO LTD
  • US11075211B2 patent drawing
  • US11075211B2 patent drawing
  • US11075211B2 patent drawing

AI summary

A semiconductor device includes a semiconductor substrate including a first region for a nonvolatile memory cell and a second region that is formed outside the first region and in which a semiconductor element differing from the nonvolatile memory cell is formed, a plurality of first element separating portions by which the first region and the second region are electrically separated from each other, a second element separating portion that is formed in the first region and that partitions the first region into a plurality of active regions, and a dummy region formed adjacently to a first portion that is one, which is closest to the first region, of the plurality of first element separating portions, and, in the semiconductor device, the first portion of the first element separating portion is equivalent in width to the second element separating portion.