Semiconductor Device Notch for Bonding Head Clearance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices with layered semiconductor chips, the bonding head for coupling bonding wires to the second semiconductor chip often interferes with the element mounting part, posing a challenge in miniaturization and ensuring proper alignment and insulation.
Innovation Solution
The semiconductor device incorporates a chip mounting part with a notch, where the second semiconductor chip overlaps the notch, and bonding wires are strategically positioned to avoid interference, with the second electrode pad located on the third principal plane of the second semiconductor chip, allowing for stable coupling without interfering with the element mounting part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the second semiconductor chip is mounted over the first semiconductor chip with bonding wires, then the semiconductor device can be miniaturized, but the bonding head interferes with the element mounting part
Solution Approach 1:
The element mounting part is segmented by introducing a notch that divides the mounting area. This segmentation allows the bonding head to access the second semiconductor chip's electrode pad without interfering with the element mounting part, resolving the spatial conflict while maintaining device miniaturization
Solution Approach 2:
The notch is designed to extend in the thickness direction of the lead frame, creating a three-dimensional solution. This vertical dimension allows the bonding head to operate in the horizontal plane while the element mounting part remains elevated, eliminating interference without increasing the device's footprint
2Manufacturing precision
If the second semiconductor chip overlaps the element mounting part, then proper alignment is achieved, but interference with the element mounting part occurs
Solution Approach 1:
The notch segments the element mounting part to create a dedicated bonding access region. This allows the second semiconductor chip to maintain its overlapping position for proper alignment while the notch provides a clear path for the bonding head, eliminating harmful interference
Solution Approach 2:
The notch acts as an intermediary structure that mediates between the overlapping chip configuration and the bonding head operation. It provides the necessary clearance for bonding wire attachment while preserving the aligned position of the second semiconductor chip over the first
Data Source
AI summary
A semiconductor device has a chip mounting part, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is mounted over the chip mounting part in a direction in which its first principal plane faces the chip mounting part. A part of the second semiconductor chip is mounted over the chip mounting part in a direction in which its third principal plane faces the first semiconductor chip. The element mounting part has a notch part. A part of the second semiconductor chip overlaps the notch part. In a region of the third principal plane of the second semiconductor chip that overlaps the notch part, a second electrode pad is provided.