Semiconductor Notch Design for Singulation Corner Integrity
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Solution Overview
Problem
During the singulation process of semiconductor devices, the corners are prone to damage due to external forces, leading to issues like cracking and delamination, as the mechanical or laser blades can hit adjacent dies, causing reliability concerns.
Innovation Solution
Forming notches at the corners of the semiconductor dies creates an empty space that disperses external forces, reducing the likelihood of damage by avoiding direct corner hits and distributing the force across multiple spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical or laser blades are used for singulation, then the semiconductor devices can be separated into individual dies, but the corners of the dies are prone to damage from external forces causing cracking and delamination
Solution Approach 1:
The patent applies preliminary action by forming notches at the corners of dies before the singulation process. These notches are created in advance to prevent corner damage during subsequent mechanical or laser cutting operations. The notches serve as pre-prepared features that redirect external forces away from the corner regions, ensuring corner integrity is maintained throughout the singulation process.
Solution Approach 2:
The patent applies segmentation by dividing the corner regions of each die through the formation of notches. This segmentation creates distinct zones where the notch removes material to create a recessed area, effectively separating the vulnerable corner tip from the main die body. This segmentation allows the corner region to be structurally differentiated, reducing stress concentration and preventing cracking during singulation operations.
2Reliability
If notches are formed at the corners of dies, then external forces are dispersed and corner damage is reduced, but additional manufacturing steps are required
Solution Approach 1:
The patent applies merging by integrating the notch formation process with the existing singulation workflow. The notches are formed as part of the overall die preparation process, combining multiple functions (corner protection and singulation) into a unified manufacturing sequence. This merging approach minimizes the addition of separate discrete steps while achieving both corner integrity and efficient die separation.
Data Source
AI summary
A semiconductor device includes a substrate and a bump. The substrate includes a first surface and a second surface. A notch is at the second surface and at a sidewall of the substrate. A depth of the notch is smaller than about half the thickness of the substrate. The bump is disposed on the first surface of the substrate.