Semiconductor Device Nut Burr Resin Intrusion Prevention
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Solution Overview
Problem
Conventional semiconductor devices face issues with resin intrusion between the insert electrode and nut during resin sealing, leading to reduced axial force and potential quality degradation due to weak attachment forces and gaps.
Innovation Solution
The semiconductor device incorporates a nut with a burr or press fit structure on the outer periphery of the direct contact surface, which is pressed into the insert electrode to prevent resin intrusion, ensuring a strong axial attachment and reliable sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional resin sealing is performed without additional fixing structures, then the manufacturing process is simple, but resin intrudes between the insert electrode and nut causing weak attachment
Solution Approach 1:
The protrusion is formed on the nut surface before resin sealing, creating a preliminary mechanical barrier that prevents resin intrusion during the subsequent resin injection process. This preliminary structural preparation ensures that when resin is injected, it cannot penetrate into the gap between the nut and insert electrode, thereby maintaining strong attachment force without requiring complex additional fixing mechanisms.
2Reliability
If a burr is provided on the nut outer periphery, then resin intrusion is prevented, but the nut structure becomes more complex
Solution Approach 1:
Instead of making the entire nut structure complex, the protrusion is localized to specific regions on the nut outer periphery where resin intrusion is most likely to occur. This localized modification creates effective resin barriers only at critical points, preventing resin penetration while keeping the overall nut structure simple and maintaining ease of manufacturing.
3Strength
If the nut is pressed into the insert electrode with press fit structure, then strong axial attachment is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The protrusion is formed on the nut before assembly, creating a mechanical barrier that prevents resin intrusion during pressing. This preliminary structural feature ensures that even with normal manufacturing tolerances, the resin cannot find pathways into the gap between nut and insert electrode, thereby maintaining strong axial attachment force without requiring extremely tight press fit tolerances.
Data Source
AI summary
An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.