Semiconductor Module Nut Holder Structure for Gas Sealing
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Solution Overview
Problem
Existing semiconductor modules face issues with sealing materials scattering and adhering to external terminals due to gas escape, leading to potential corrosion and reduced reliability.
Innovation Solution
A semiconductor module design featuring a nut holding portion with a first narrow and first wide portion, and a locking mechanism that aligns terminals and nuts, reducing the size of the groove between the housing and nut holding portion to prevent gas ingress and enhance corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor module structure is used, then the assembly process is simple, but sealing material scatters and adheres to external terminals due to gas escape, causing corrosion and reliability issues
Solution Approach 1:
The nut holding portion is divided into multiple segments: a first narrow portion, a first wide portion, and a second narrow portion. This segmentation creates a structured groove pattern that controls gas flow paths, preventing sealing material from scattering to external terminals while maintaining structural integrity and corrosion resistance.
Solution Approach 2:
Different portions of the nut holding structure have different widths (narrow and wide portions) to create localized characteristics. The wide portions act as gas traps while narrow portions guide gas flow, locally controlling where gas escapes to prevent harmful adhesion to terminals while maintaining overall structural simplicity.
2Reliability
If the groove between housing and nut holding portion is large, then assembly is easier, but gas ingress occurs leading to sealing material adhesion on terminals
Solution Approach 1:
The groove space is segmented into multiple regions with varying widths. The first narrow portion, first wide portion, and second narrow portion create a stepped structure that restricts gas ingress into critical areas while maintaining adequate assembly clearance. This segmentation prevents sealing material adhesion without compromising ease of manufacture.
3Reliability
If terminals and nuts are not precisely aligned, then assembly is faster, but electrical connection reliability decreases
Solution Approach 1:
The nut holding portion is pre-formed with specific narrow and wide portions that create natural alignment features during assembly. The first narrow portion aligns with the terminal position, and the first wide portion provides a positioning reference, enabling automatic alignment as the nut holding portion is inserted into the housing, thereby eliminating separate alignment steps.
Solution Approach 2:
The structured groove pattern with alternating narrow and wide portions enables self-alignment during the insertion process. The geometry of the nut holding portion itself provides the alignment function, allowing terminals and nuts to automatically position correctly without external alignment mechanisms or additional adjustment steps.
Data Source
AI summary
Provided is a semiconductor module including: a housing portion which houses a semiconductor chip; at least one terminal which is electrically connected with the semiconductor chip; and a nut holding portion which includes a nut for coupling with the terminal and is inserted into the housing portion along a predetermined insertion direction. The nut holding portion may include a first narrow portion and a first wide portion which is provided on a side opposite to the insertion direction with respect to the first narrow portion and has a width greater than a width of the first narrow portion. The housing portion may include a locking portion which locks the nut holding portion by coming into contact with the first wide portion.