Semiconductor Module with Nut Housing for Busbar Stacking
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Solution Overview
Problem
Existing semiconductor modules face challenges in easy connection and integration of multiple units to achieve higher output, as current configurations complicate the assembly and alignment of semiconductor elements and wiring substrates.
Innovation Solution
A semiconductor module design featuring an insulating substrate with a metal plate, semiconductor elements, a wiring substrate, a sealing member with a protruding main terminal, and a nut and busbar terminal configuration that allows for easy electrical connection and stacking of modules, enabling efficient series connection of semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor modules are connected to achieve larger output, then the output capacity is improved, but the complexity of connection and alignment increases
Solution Approach 1:
The semiconductor module is divided into standardized modular units, each with identical terminal configurations. This segmentation allows modules to be connected in series or parallel through simple alignment of corresponding terminals, reducing connection complexity while enabling scalable output capacity.
Solution Approach 2:
The terminal structure is designed with universal compatibility features, including standardized nut positions and insertion holes that work across all module types. This universality enables different semiconductor modules to be interconnected using the same connection methodology, simplifying the overall connection process.
2Ease of operation
If the terminal structure is simplified for easier connection, then the ease of operation is improved, but the reliability of electrical connection may deteriorate
Solution Approach 1:
The nut is pre-positioned in the sealing member at a predetermined position before connection. This preliminary action ensures that when the busbar terminal is inserted, the connection point is already prepared and aligned, making the connection process simple while ensuring reliable electrical contact through pre-established positioning.
Solution Approach 2:
The sealing member acts as an intermediary component that integrates both the nut and the terminal structure. This intermediary element provides a unified interface that simultaneously ensures mechanical stability and electrical conductivity, simplifying connection while maintaining reliability through integrated design.
3Ease of manufacture
If the nut is positioned outside the sealing member for easy access, then the ease of manufacture is improved, but the mechanical stress on terminals increases
Solution Approach 1:
The nut is nested within the sealing member structure rather than being externally mounted. This nesting arrangement allows the nut to be easily accessed and installed from the same side as the terminal connection, simplifying assembly while distributing mechanical stress through the integrated sealing member structure rather than concentrating it on the terminal alone.
Data Source
AI summary
A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut.